Rectangular Connectors - Headers, Receptacles, Female Sockets

Image Part Number Description / PDF Quantity Rfq
920-0133-01

920-0133-01

SchmartBoard

CONN HDR 20POS 0.1 GOLD PCB 4PC

48

920-0131-01

920-0131-01

SchmartBoard

CONN HDR 26POS 0.1 GOLD PCB 2PC

0

920-0201-01

920-0201-01

SchmartBoard

CONN HDR 40POS PCB R/A 3PC

9

920-0200-01

920-0200-01

SchmartBoard

CONN HDR 40POS PCB R/A 3PC

37

920-0085-01

920-0085-01

SchmartBoard

CONN HDR 6POS 0.1 GOLD PCB 6PC

155

920-0088-01

920-0088-01

SchmartBoard

CONN HDR 8/10P 0.1 GOLD PCB 6PC

45

920-0132-01

920-0132-01

SchmartBoard

CONN HDR 26POS GOLD PCB 3PC

65

920-0171-01

920-0171-01

SchmartBoard

CONN HDR 40POS 0.1 GOLD PCB 3PC

117

920-0134-01

920-0134-01

SchmartBoard

CONN HDR 26POS 0.1 GOLD PCB 4PC

19

920-0087-01

920-0087-01

SchmartBoard

CONN HDR 10POS 0.1 GOLD PCB 6PC

154

920-0135-01

920-0135-01

SchmartBoard

CONN HDR 40POS 0.1 GOLD PCB 4PC

63

920-0086-01

920-0086-01

SchmartBoard

CONN HDR 8POS 0.1 GOLD PCB 6PC

179

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row HeadersLinear arrangement of male pinsArduino shields, sensor modules
Double-Row HeadersDual-row pin configuration for higher densityComputer motherboards, industrial controllers
Right-Angle Receptacles90 orientation for space-constrained designsCompact medical devices, automotive sensors
Stacking Female SocketsVertical interconnection for multi-board systems3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

  • Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
  • Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
  • Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
  • Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

ParameterValue/RangeImportance
Current Rating0.5A - 10A per contactDetermines power transmission capacity
Contact Resistance5-20m Affects signal integrity and thermal performance
Dielectric Strength500V - 2500V ACEnsures electrical safety and insulation reliability
Operating Temperature-55 C to +125 CDefines environmental tolerance
Mating Cycles100 - 10,000 cyclesIndicates mechanical durability

5. Application Fields

  • Consumer Electronics: Smartphones, laptops, gaming consoles
  • Industrial Automation: PLCs, motor drives, sensor hubs
  • Telecommunications: 5G base stations, network routers
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityMicroSpeed Rectangular Connectors
MolexPicoBlade 0.8mm Headers
AmphenolMICRO CONECTA Surface Mount Sockets
SamtecQTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • PCB space constraints and stacking needs
  • Environmental factors (temperature, vibration, moisture)
  • Cost-effectiveness vs. long-term reliability
  • Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

  • Miniaturization: Sub-1.0mm pitch connectors for wearable devices
  • High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
  • Enhanced reliability: Hermetic sealing for aerospace applications
  • Modular designs: Tool-less hot-swap systems for data centers
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