Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
HLE-107-02-G-DV-BE Samtec, Inc.	CONN RCPT 14POS 0.1 GOLD SMD	464
851-41-006-30-001000 Mill-Max	CONN RCPT 6POS 0.05 GOLD SMD	0
415-83-230-41-001101 Preci-Dip	CONN SOCKET 30POS 0.1 GOLD PCB	0
803-83-038-10-004101 Preci-Dip	CONN SOCKET 38POS 0.1 GOLD PCB	0
310-87-107-01-666101 Preci-Dip	CONN SOCKET 7POS 0.1 GOLD PCB	0
801-83-026-20-001101 Preci-Dip	CONN SOCKET 26P 0.1 GOLD PCB R/A	0
BCS-129-L-S-PE Samtec, Inc.	CONN RCPT 29POS 0.1 GOLD PCB	0
803-83-082-65-001101 Preci-Dip	CONN SOCKET 82POS 0.1 GOLD PCB	0
CLP-116-02-F-D-BE-PA-TR Samtec, Inc.	CONN RCPT 32POS 0.05 GOLD SMD	0
805-83-009-10-003101 Preci-Dip	CONN SOCKET 9POS 0.1 GOLD PCB	0
CLE-146-01-G-DV-A Samtec, Inc.	CONN RCPT 92POS 0.031 GOLD SMD	0
HIF6A-100DA-1.27DSA(71) Hirose	CONN RCPT 100POS 0.05 GOLD PCB	0
317-83-104-41-022101 Preci-Dip	CONN SOCKET 4POS 0.07 GOLD PCB	0
415-83-252-41-001101 Preci-Dip	CONN SOCKET 52POS 0.1 GOLD PCB	0
803-87-028-65-001101 Preci-Dip	CONN SOCKET 28POS 0.1 GOLD PCB	0
HLE-106-02-G-DV Samtec, Inc.	CONN RCPT 12POS 0.1 GOLD SMD	8292
DF11Z-24DS-2V(22) Hirose	CONN RCPT 24POS 0.079 GOLD SMD	0
416-87-250-41-004101 Preci-Dip	CONN SOCKET 50POS 0.1 GOLD PCB	0
FLE-145-01-G-DV-K-TR Samtec, Inc.	CONN RCPT 90POS 0.05 GOLD SMD	0
322-87-145-41-001101 Preci-Dip	CONN SOCKET 45POS 0.1 GOLD PCB	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers