Rectangular Connectors - Headers, Male Pins

Image Part Number Description / PDF Quantity Rfq
620103131822

620103131822

Würth Elektronik Midcom

CONN HEADER SMD R/A 3POS 2MM

23

62403821722

62403821722

Würth Elektronik Midcom

CONN HEADER R/A 38POS 2MM

0

62402021722

62402021722

Würth Elektronik Midcom

CONN HEADER R/A 20POS 2MM

0

61304421121

61304421121

Würth Elektronik Midcom

CONN HEADER VERT 44POS 2.54MM

0

66201421122

66201421122

Würth Elektronik Midcom

CONN HEADER VERT 14POS 3MM

16

620304124022

620304124022

Würth Elektronik Midcom

CONN HEADER SMD 4POS 2MM

2140

61201021621

61201021621

Würth Elektronik Midcom

CONN HEADER VERT 10POS 2.54MM

13282

61001418221

61001418221

Würth Elektronik Midcom

CONN HEADER SMD 14POS 2.54MM

188

662107145021

662107145021

Würth Elektronik Midcom

CONN HEADER SMD R/A 7POS 3MM

0

61200821621

61200821621

Würth Elektronik Midcom

CONN HEADER VERT 8POS 2.54MM

2056

Rectangular Connectors - Headers, Male Pins

1. Overview

Rectangular connectors with male pins, commonly referred to as pin headers, are modular electrical interfaces featuring parallel rows of conductive prongs enclosed in a dielectric housing. These components enable reliable signal and power transmission between PCBs (Printed Circuit Boards), cables, and subsystems. Their standardized design, ease of assembly, and scalability make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Single-Row Headers Linear arrangement, 0.1" pitch standard, low-cost solution Prototyping boards, Arduino shields
Double-Row Headers Parallel dual-row configuration, higher contact density Industrial control systems, PLC modules
High-Density Headers Sub-0.05" pitch, optimized for miniaturization Smartphones, medical sensors
Right-Angle Headers 90 oriented pins for vertical space optimization Automotive ECUs, server motherboards

3. Structure and Composition

Typical male pin headers consist of:

  • Contact System: Phosphor bronze or beryllium copper pins with gold-plated contact areas
  • Insulation Housing: High-temperature resistant LCP (Liquid Crystal Polymer) or nylon material
  • Mechanical Features: Polarization keying, anti-wobble design, and retention latches
  • Mounting Options: Through-hole, SMT (Surface Mount Technology), or press-fit terminations

The contacts are arranged in standardized grids (commonly 2.54mm/0.1" pitch) with polarization features to prevent mis-mating.

4. Key Technical Specifications

Parameter Importance
Current Rating (Amps/contact) 0.5-10A determines power handling capability
Contact Resistance (m ) 10-30m affects signal integrity and power efficiency
Dielectric Withstanding Voltage 100-1000V defines insulation reliability
Operating Temperature Range -55 C to +125 C ensures environmental durability
Insertion Force (N) 0.5-5N impacts mating cycle longevity

5. Application Fields

  • Consumer Electronics: Laptops, gaming consoles, smart home devices
  • Automotive: ECU interconnects, sensor harnesses, infotainment systems
  • Industrial: CNC machine controllers, robotics interfaces
  • Medical: Diagnostic equipment, patient monitoring systems
  • Telecom: Base station hardware, fiber optic transceivers

6. Leading Manufacturers and Products

Manufacturer Representative Product
TE Connectivity AMPMODU 205796-1 (0.05" micro pitch header)
Molex PicoBlade 0510210400 (ultra-compact wire-to-board connector)
Amphenol ICC 10118801-01 (high-speed differential pair header)
JAE Electronics DF11 Series (0.5mm pitch FPC-to-PCB connector)

7. Selection Guidelines

Key considerations:

  1. Electrical requirements (current/voltage rating)
  2. Space constraints (pitch size and profile height)
  3. Environmental conditions (temperature, vibration, moisture)
  4. Termination method compatibility (through-hole vs SMT)
  5. Expected mating cycles (durability requirements)
  6. Cost vs performance trade-offs

Example: For automotive applications, select headers with AEC-Q200 certification and 3 m gold plating for vibration resistance.

8. Industry Trends

  • Miniaturization: Development of 0.3mm pitch connectors for wearable devices
  • High-Speed Performance: Optimization for 10+ Gbps data rates in 5G infrastructure
  • Modular Design: Integration with hybrid power/signal transmission capabilities
  • Sustainability: Adoption of halogen-free materials and RoHS compliance
  • Smart Manufacturing: Embedded RFID tags for connector lifecycle tracking
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