Rectangular Connectors - Headers, Male Pins

Part Number	Description / PDF	Quantity
109915 ERNI Electronics	IBRIDGE 2MM 03POS M RA SMT	700
234207 ERNI Electronics	SMC M VERT Q 26POS SMT 4.85MM	356
109905 ERNI Electronics	IBRIDGE 2MM 06POS M VERT SMT	400
244857 ERNI Electronics	SMC M VERT Q 68POS SMT 3.25MM	225
214011 ERNI Electronics	MIBR M 02POS RA A SMT	997
109901 ERNI Electronics	IBRIDGE 2MM 02POS M VERT SMT	0
109916 ERNI Electronics	IBRIDGE 2MM 04POS M RA SMT	695
474813 ERNI Electronics	MIBR M 12POS RA A SMT KS	1000
474810 ERNI Electronics	MIBR M 06POS RA A SMT KS	948
474817 ERNI Electronics	MIBR M 06POS VERT P SMT KS	995
284656 ERNI Electronics	MAXIBR M 02POS VERT P SMT BK	599
244856 ERNI Electronics	SMC M VERT Q 50POS SMT 3.25MM	157
054595 ERNI Electronics	SMC M RA B 26POS SMT	510
254416 ERNI Electronics	SMC M VERT Q 32POS SMT 4.85MM	250
154765 ERNI Electronics	SMC M RA B 50POS SMT	550
054596 ERNI Electronics	SMC M RA B 50POS SMT	350
354949 ERNI Electronics	SMC M RA B 12POS SMT LOCK	560

Rectangular Connectors - Headers, Male Pins

1. Overview

Rectangular connectors with male pins, commonly referred to as pin headers, are modular electrical interfaces featuring parallel rows of conductive prongs enclosed in a dielectric housing. These components enable reliable signal and power transmission between PCBs (Printed Circuit Boards), cables, and subsystems. Their standardized design, ease of assembly, and scalability make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-Row Headers	Linear arrangement, 0.1" pitch standard, low-cost solution	Prototyping boards, Arduino shields
Double-Row Headers	Parallel dual-row configuration, higher contact density	Industrial control systems, PLC modules
High-Density Headers	Sub-0.05" pitch, optimized for miniaturization	Smartphones, medical sensors
Right-Angle Headers	90 oriented pins for vertical space optimization	Automotive ECUs, server motherboards

3. Structure and Composition

Typical male pin headers consist of:

Contact System: Phosphor bronze or beryllium copper pins with gold-plated contact areas
Insulation Housing: High-temperature resistant LCP (Liquid Crystal Polymer) or nylon material
Mechanical Features: Polarization keying, anti-wobble design, and retention latches
Mounting Options: Through-hole, SMT (Surface Mount Technology), or press-fit terminations

The contacts are arranged in standardized grids (commonly 2.54mm/0.1" pitch) with polarization features to prevent mis-mating.

4. Key Technical Specifications

Parameter	Importance
Current Rating (Amps/contact)	0.5-10A determines power handling capability
Contact Resistance (m )	10-30m affects signal integrity and power efficiency
Dielectric Withstanding Voltage	100-1000V defines insulation reliability
Operating Temperature Range	-55 C to +125 C ensures environmental durability
Insertion Force (N)	0.5-5N impacts mating cycle longevity

5. Application Fields

Consumer Electronics: Laptops, gaming consoles, smart home devices
Automotive: ECU interconnects, sensor harnesses, infotainment systems
Industrial: CNC machine controllers, robotics interfaces
Medical: Diagnostic equipment, patient monitoring systems
Telecom: Base station hardware, fiber optic transceivers

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	AMPMODU 205796-1 (0.05" micro pitch header)
Molex	PicoBlade 0510210400 (ultra-compact wire-to-board connector)
Amphenol ICC	10118801-01 (high-speed differential pair header)
JAE Electronics	DF11 Series (0.5mm pitch FPC-to-PCB connector)

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage rating)
Space constraints (pitch size and profile height)
Environmental conditions (temperature, vibration, moisture)
Termination method compatibility (through-hole vs SMT)
Expected mating cycles (durability requirements)
Cost vs performance trade-offs

Example: For automotive applications, select headers with AEC-Q200 certification and 3 m gold plating for vibration resistance.

8. Industry Trends

Miniaturization: Development of 0.3mm pitch connectors for wearable devices
High-Speed Performance: Optimization for 10+ Gbps data rates in 5G infrastructure
Modular Design: Integration with hybrid power/signal transmission capabilities
Sustainability: Adoption of halogen-free materials and RoHS compliance
Smart Manufacturing: Embedded RFID tags for connector lifecycle tracking