Rectangular Connectors - Headers, Male Pins

Image	Part Number	Description / PDF	Quantity	Rfq
	TP04R3E03Y VEAM	CONN HEADER R/A 4POS 2.54MM	0
	MTB1-13PL1 VEAM	MICRO 13 M .50" UNINS	0
	MTB2-15PAL1 VEAM	MTB2-15PAL1	0
	192900-0416 VEAM	TRI SNAP 24 PIN REC PCB GLD ST	0
	MTB1-5PAL1 VEAM	MTB1-5PAL1	0
	MTB2-34SL1-01 VEAM	MTB2-34SL1-01	0
	MTB2-21PL79 VEAM	096642-0000	0
	192991-0295 VEAM	TRI SNAP 6 PIN RECP PCB TIN MC	0
	192991-0302 VEAM	TRI SNAP 12 PIN REC PCB GLD MC	0
	192991-0270 VEAM	CONN HEADER VERT 2POS 5.08MM	0
	192991-0303 VEAM	TRI SNAP 12 PIN REC PCB TIN MC	0
	MTV1-13PL61 VEAM	MICRO 13 M .050" STRIP	0
	192991-0318 VEAM	TRI SNAP 4 PIN HEADER PCB TIN	0
	192991-0279 VEAM	TRI SNAP 3 PIN RECP PCB TIN MC	0
	MTV1-32PAL1-01 VEAM	MTV1-32PAL1-01	0
	MTB2-16PAL2 VEAM	MTB2-16PAL2	0
	192991-0403 VEAM	TRI SNAP 36 PIN REC PCB TIN MC	0
	192990-3250 VEAM	TRI SNAP 4 PIN RECP PCB TIN ST	0
	MTB1-20PAL-61 VEAM	095288-0034	0
	MTV1-20PL80 VEAM	097448-0005	0

Rectangular Connectors - Headers, Male Pins

1. Overview

Rectangular connectors with male pins, commonly referred to as pin headers, are modular electrical interfaces featuring parallel rows of conductive prongs enclosed in a dielectric housing. These components enable reliable signal and power transmission between PCBs (Printed Circuit Boards), cables, and subsystems. Their standardized design, ease of assembly, and scalability make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-Row Headers	Linear arrangement, 0.1" pitch standard, low-cost solution	Prototyping boards, Arduino shields
Double-Row Headers	Parallel dual-row configuration, higher contact density	Industrial control systems, PLC modules
High-Density Headers	Sub-0.05" pitch, optimized for miniaturization	Smartphones, medical sensors
Right-Angle Headers	90 oriented pins for vertical space optimization	Automotive ECUs, server motherboards

3. Structure and Composition

Typical male pin headers consist of:

Contact System: Phosphor bronze or beryllium copper pins with gold-plated contact areas
Insulation Housing: High-temperature resistant LCP (Liquid Crystal Polymer) or nylon material
Mechanical Features: Polarization keying, anti-wobble design, and retention latches
Mounting Options: Through-hole, SMT (Surface Mount Technology), or press-fit terminations

The contacts are arranged in standardized grids (commonly 2.54mm/0.1" pitch) with polarization features to prevent mis-mating.

4. Key Technical Specifications

Parameter	Importance
Current Rating (Amps/contact)	0.5-10A determines power handling capability
Contact Resistance (m )	10-30m affects signal integrity and power efficiency
Dielectric Withstanding Voltage	100-1000V defines insulation reliability
Operating Temperature Range	-55 C to +125 C ensures environmental durability
Insertion Force (N)	0.5-5N impacts mating cycle longevity

5. Application Fields

Consumer Electronics: Laptops, gaming consoles, smart home devices
Automotive: ECU interconnects, sensor harnesses, infotainment systems
Industrial: CNC machine controllers, robotics interfaces
Medical: Diagnostic equipment, patient monitoring systems
Telecom: Base station hardware, fiber optic transceivers

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	AMPMODU 205796-1 (0.05" micro pitch header)
Molex	PicoBlade 0510210400 (ultra-compact wire-to-board connector)
Amphenol ICC	10118801-01 (high-speed differential pair header)
JAE Electronics	DF11 Series (0.5mm pitch FPC-to-PCB connector)

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage rating)
Space constraints (pitch size and profile height)
Environmental conditions (temperature, vibration, moisture)
Termination method compatibility (through-hole vs SMT)
Expected mating cycles (durability requirements)
Cost vs performance trade-offs

Example: For automotive applications, select headers with AEC-Q200 certification and 3 m gold plating for vibration resistance.

8. Industry Trends

Miniaturization: Development of 0.3mm pitch connectors for wearable devices
High-Speed Performance: Optimization for 10+ Gbps data rates in 5G infrastructure
Modular Design: Integration with hybrid power/signal transmission capabilities
Sustainability: Adoption of halogen-free materials and RoHS compliance
Smart Manufacturing: Embedded RFID tags for connector lifecycle tracking