Rectangular Connectors - Headers, Male Pins

Image Part Number Description / PDF Quantity Rfq
MTB-7PL80

MTB-7PL80

VEAM

CONN HEADER 7POS 1.27MM

0

MTV1-30PL80

MTV1-30PL80

VEAM

MICRO

0

TST06RB05T

TST06RB05T

VEAM

CONN HEADER VERT 6POS 5.08MM

0

MTB1-20PAL61

MTB1-20PAL61

VEAM

CONN HEADER R/A 20POS 1.27MM

0

MJSV-34PL94

MJSV-34PL94

VEAM

CONN HEADER VERT 34POS

0

MTV1-32PL61

MTV1-32PL61

VEAM

MICRO

0

MJSB-26PL91

MJSB-26PL91

VEAM

CONN HEADER VERT 26POS

0

MJSV-34PL99

MJSV-34PL99

VEAM

CONN HEADER VERT 34POS

0

MJSV-34PL81

MJSV-34PL81

VEAM

CONN HEADER VERT 34POS

0

MTV1-120PL2

MTV1-120PL2

VEAM

MICRO

0

MTB1-5PAL82

MTB1-5PAL82

VEAM

CONN HEADER R/A 5POS 1.27MM

0

TST04RB05Y

TST04RB05Y

VEAM

CONN HEADER VERT 4POS 5.08MM

0

MTB1-10PAL1-01

MTB1-10PAL1-01

VEAM

CONN HEADER R/A 10POS 1.27MM

0

MJSV-16PL86

MJSV-16PL86

VEAM

CONN HEADER VERT 16POS

0

MJSR-34PL61-1

MJSR-34PL61-1

VEAM

CONN HEADER VERT 34POS

0

MTB1-4PAL57-01

MTB1-4PAL57-01

VEAM

CONN HEADER R/A 4POS 1.27MM

0

MTB1-9PAL61

MTB1-9PAL61

VEAM

CONN HEADER R/A 9POS 1.27MM

0

MTB1-8PAL1-01

MTB1-8PAL1-01

VEAM

CONN HEADER R/A 8POS 1.27MM

0

MTB1-50PL1

MTB1-50PL1

VEAM

CONN HEADER VERT 50POS 1.27MM

0

MTB1-20PAL79

MTB1-20PAL79

VEAM

CONN HEADER R/A 20POS 1.27MM

0

Rectangular Connectors - Headers, Male Pins

1. Overview

Rectangular connectors with male pins, commonly referred to as pin headers, are modular electrical interfaces featuring parallel rows of conductive prongs enclosed in a dielectric housing. These components enable reliable signal and power transmission between PCBs (Printed Circuit Boards), cables, and subsystems. Their standardized design, ease of assembly, and scalability make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Single-Row Headers Linear arrangement, 0.1" pitch standard, low-cost solution Prototyping boards, Arduino shields
Double-Row Headers Parallel dual-row configuration, higher contact density Industrial control systems, PLC modules
High-Density Headers Sub-0.05" pitch, optimized for miniaturization Smartphones, medical sensors
Right-Angle Headers 90 oriented pins for vertical space optimization Automotive ECUs, server motherboards

3. Structure and Composition

Typical male pin headers consist of:

  • Contact System: Phosphor bronze or beryllium copper pins with gold-plated contact areas
  • Insulation Housing: High-temperature resistant LCP (Liquid Crystal Polymer) or nylon material
  • Mechanical Features: Polarization keying, anti-wobble design, and retention latches
  • Mounting Options: Through-hole, SMT (Surface Mount Technology), or press-fit terminations

The contacts are arranged in standardized grids (commonly 2.54mm/0.1" pitch) with polarization features to prevent mis-mating.

4. Key Technical Specifications

Parameter Importance
Current Rating (Amps/contact) 0.5-10A determines power handling capability
Contact Resistance (m ) 10-30m affects signal integrity and power efficiency
Dielectric Withstanding Voltage 100-1000V defines insulation reliability
Operating Temperature Range -55 C to +125 C ensures environmental durability
Insertion Force (N) 0.5-5N impacts mating cycle longevity

5. Application Fields

  • Consumer Electronics: Laptops, gaming consoles, smart home devices
  • Automotive: ECU interconnects, sensor harnesses, infotainment systems
  • Industrial: CNC machine controllers, robotics interfaces
  • Medical: Diagnostic equipment, patient monitoring systems
  • Telecom: Base station hardware, fiber optic transceivers

6. Leading Manufacturers and Products

Manufacturer Representative Product
TE Connectivity AMPMODU 205796-1 (0.05" micro pitch header)
Molex PicoBlade 0510210400 (ultra-compact wire-to-board connector)
Amphenol ICC 10118801-01 (high-speed differential pair header)
JAE Electronics DF11 Series (0.5mm pitch FPC-to-PCB connector)

7. Selection Guidelines

Key considerations:

  1. Electrical requirements (current/voltage rating)
  2. Space constraints (pitch size and profile height)
  3. Environmental conditions (temperature, vibration, moisture)
  4. Termination method compatibility (through-hole vs SMT)
  5. Expected mating cycles (durability requirements)
  6. Cost vs performance trade-offs

Example: For automotive applications, select headers with AEC-Q200 certification and 3 m gold plating for vibration resistance.

8. Industry Trends

  • Miniaturization: Development of 0.3mm pitch connectors for wearable devices
  • High-Speed Performance: Optimization for 10+ Gbps data rates in 5G infrastructure
  • Modular Design: Integration with hybrid power/signal transmission capabilities
  • Sustainability: Adoption of halogen-free materials and RoHS compliance
  • Smart Manufacturing: Embedded RFID tags for connector lifecycle tracking
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