| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Storage & Server IO (Amphenol ICC) |
CONN HDR 8POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 6POS 0.1 STACK T/H TIN |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
MTK R/R STR HDR |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 34POS 0.079 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 18POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
MTK R/R SMT HDR |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 5POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 16POS 0.1 STACK SMD |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 10POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 10POS 0.079 STACK SMD |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 26POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 40POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 40POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 10POS 0.079 STACK SMD |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
HDR STR DR DB. 100 GP-2P-DEROG |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 50POS 0.1 STACK SMD |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 22POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 20POS 0.1 STACK T/H |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONN HDR 12POS 0.1 STACK T/H |
0 |
|
Rectangular board spacers and stackers are interconnect solutions designed to establish mechanical and electrical connections between two or more printed circuit boards (PCBs). These connectors maintain precise spacing while enabling signal/power transmission. Their importance in modern electronics includes enabling compact designs, modular system architectures, and reliable high-speed data transfer in applications ranging from consumer devices to industrial equipment.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Board Spacers | Fixed pitch, non-mating interconnects with insulating pillars | Smartphone mid-frames, IoT sensor modules |
| Stacking Connectors | Self-mating design with compressible contacts | Embedded computing boards, FPGA development kits |
| High-Speed Stackers | Controlled impedance, low crosstalk design | 5G base stations, network switches |
| Compliant Pin Stackers | Press-fit terminations for Z-axis compliance | Automotive radar systems, medical imaging devices |
Typical construction includes:
| Parameter | Typical Range | Importance |
|---|---|---|
| Current Rating | 0.5A - 5A per contact | Dictates power delivery capability |
| Contact Resistance | 5-20m | Impacts signal integrity |
| Dielectric Strength | 500V - 2500V AC | Ensures electrical safety |
| Operating Temperature | -55 C to +125 C | Determines environmental robustness |
| Insertion Force | 0.5N - 5N per contact | Affects assembly process |
| Mating Cycles | 500 - 10,000 cycles | Defines service life expectancy |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TE Connectivity | SMART Board Stacker | 12 Gbps capability, self-aligning |
| Molex | Impel High-Speed Connector | 25+ Gbps, floating compliance |
| Amphenol | CBGA Interposer | Micro BGA footprint compatibility |
| JAE Electronics | DF59 Series | 0.4mm pitch, 0.3mm stack height |
Key considerations:
Case Study: In automotive camera module design, compliant pin stackers reduced assembly time by 40% while maintaining ISO 16750 vibration compliance.