Rectangular Connectors - Board Spacers, Stackers (Board to Board)

Image Part Number Description / PDF Quantity Rfq
951424-2061709-AR-PT

951424-2061709-AR-PT

3M

CONN HDR 24POS 0.079 STACK SMD

0

951440-2011709-AR-PT

951440-2011709-AR-PT

3M

CONN HDR 40POS 0.079 STACK SMD

0

951414-4061409-AR-PT

951414-4061409-AR-PT

3M

CONN HDR 14POS 0.079 STACK SMD

0

926582-01-35-EU

926582-01-35-EU

3M

CONN HDR 70POS 0.1 STACK T/H

0

961444-8041704-AR

961444-8041704-AR

3M

CONN HDR 44POS 0.1 STACK T/H

0

924227-32-34-I

924227-32-34-I

3M

CONN HDR 68POS 0.1 STACK T/H

0

951448-2062009-AR-PT

951448-2062009-AR-PT

3M

CONN HDR 48POS 0.079 STACK SMD

0

924227-32-32-I

924227-32-32-I

3M

CONN HDR 64POS 0.1 STACK T/H

0

951406-9012506-AR

951406-9012506-AR

3M

CONN HDR 6POS 0.079 STACK T/H

0

926121-01-36-EU

926121-01-36-EU

3M

CONN HDR 36POS 0.1 STACK T/H

0

951438-8061506-AR

951438-8061506-AR

3M

CONN HDR 38POS 0.079 STACK T/H

0

951416-4011309-AR-TP

951416-4011309-AR-TP

3M

CONN HDR 16POS 0.079 STACK SMD

0

951440-2011709-AR-TP

951440-2011709-AR-TP

3M

CONN HDR 40POS 0.079 STACK SMD

0

961413-9041704-AR

961413-9041704-AR

3M

CONN HDR 13POS 0.1 STACK T/H

0

961431-9041804-AR

961431-9041804-AR

3M

CONN HDR 31POS 0.1 STACK T/H

0

926781-01-14-EU

926781-01-14-EU

3M

CONN HDR 14POS 0.1 STACK T/H

0

951430-8062506-AR

951430-8062506-AR

3M

CONN HDR 30POS 0.079 STACK T/H

0

961416-8040604-AR

961416-8040604-AR

3M

CONN HDR 16POS 0.1 STACK T/H

0

951409-9011106-AR

951409-9011106-AR

3M

CONN HDR 9POS 0.079 STACK T/H

0

951414-4011309-AR-TP

951414-4011309-AR-TP

3M

CONN HDR 14POS 0.079 STACK SMD

0

Rectangular Connectors - Board Spacers, Stackers (Board to Board)

1. Overview

Rectangular board spacers and stackers are interconnect solutions designed to establish mechanical and electrical connections between two or more printed circuit boards (PCBs). These connectors maintain precise spacing while enabling signal/power transmission. Their importance in modern electronics includes enabling compact designs, modular system architectures, and reliable high-speed data transfer in applications ranging from consumer devices to industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Board SpacersFixed pitch, non-mating interconnects with insulating pillarsSmartphone mid-frames, IoT sensor modules
Stacking ConnectorsSelf-mating design with compressible contactsEmbedded computing boards, FPGA development kits
High-Speed StackersControlled impedance, low crosstalk design5G base stations, network switches
Compliant Pin StackersPress-fit terminations for Z-axis complianceAutomotive radar systems, medical imaging devices

3. Structure and Components

Typical construction includes:

  • Insulating housing (LCP/PBT with UL94 V-0 rating)
  • Phosphor bronze or beryllium copper contacts
  • Gold-plated contact areas (0.5-3 m thickness)
  • Polarization keying to prevent misalignment
  • Integrated locking mechanisms (latches/snap-fits)
  • Optional EMI shielding layers

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating0.5A - 5A per contactDictates power delivery capability
Contact Resistance5-20m Impacts signal integrity
Dielectric Strength500V - 2500V ACEnsures electrical safety
Operating Temperature-55 C to +125 CDetermines environmental robustness
Insertion Force0.5N - 5N per contactAffects assembly process
Mating Cycles500 - 10,000 cyclesDefines service life expectancy

5. Application Fields

  • Telecommunications: Server backplanes, 5G NR radios
  • Industrial Automation: PLC modules, CNC controller stacks
  • Consumer Electronics: Foldable device hinge connectors
  • Medical Devices: MRI system detector arrays
  • Automotive: ADAS sensor stacking modules

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivitySMART Board Stacker12 Gbps capability, self-aligning
MolexImpel High-Speed Connector25+ Gbps, floating compliance
AmphenolCBGA InterposerMicro BGA footprint compatibility
JAE ElectronicsDF59 Series0.4mm pitch, 0.3mm stack height

7. Selection Recommendations

Key considerations:

  • Electrical requirements vs. contact density needs
  • Stack height tolerance stack-up analysis
  • Thermal expansion coefficient matching
  • Field serviceability requirements
  • Automated optical inspection (AOI) compatibility

Case Study: In automotive camera module design, compliant pin stackers reduced assembly time by 40% while maintaining ISO 16750 vibration compliance.

8. Industry Trends

  • Migration to 0.3mm pitch connectors for mobile applications
  • Integration of coaxial contacts for RF board-to-board links
  • Adoption of additive manufacturing for complex shapes
  • Increased adoption of press-fit terminations in harsh environments
  • Development of hybrid optical-electrical stacking solutions
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