Rectangular Connectors - Board Spacers, Stackers (Board to Board)

Part Number	Description / PDF	Quantity
FW-20-05-F-D-554-075-ES Samtec, Inc.	CONN HDR 40POS 0.05 STACK SMD	0
ZW-18-14-G-S-689-236 Samtec, Inc.	CONN BRD STACK .100" 18POS	148
DW-10-10-S-D-450 Samtec, Inc.	CONN HDR 20POS 0.1 STACK T/H	1048
ZW-07-20-L-D-790-120 Samtec, Inc.	CONN BRD STACK .100" 14POS	994
ZW-36-10-T-S-450-190 Samtec, Inc.	CONN BRD STACK .100" 36POS	79
DW-05-13-T-D-792 Samtec, Inc.	CONN HDR 10POS 0.1 STACK T/H TIN	524
HW-25-09-S-D-400-SM-A Samtec, Inc.	CONN HDR 50POS 0.1 STACK SMD	66
EW-08-11-S-D-430 Samtec, Inc.	CONN HDR 16POS 0.1 STACK T/H	869
TW-05-09-L-D-180-060 Samtec, Inc.	CONN BRD STACK 2.00 10POS	371
TW-02-03-T-D-275-100 Samtec, Inc.	CONN BRD STACK 2.00 4POS	372
FW-15-05-L-D-375-160-P-TR Samtec, Inc.	CONN HDR 30POS 0.05 STACK SMD	0
FW-06-05-L-D-425-075 Samtec, Inc.	CONN HDR 12POS 0.05 STACK SMD	0
54122-113342500LF Storage & Server IO (Amphenol ICC)	CONN HDR 34POS 0.1 STACK T/H	0
DW-14-12-F-D-680 Samtec, Inc.	CONN HDR 28POS 0.1 STACK T/H	0
DW-04-12-F-D-650 Samtec, Inc.	CONN HDR 8POS 0.1 STACK T/H GOLD	0
54122-107120950LF Storage & Server IO (Amphenol ICC)	CONN HDR 12POS 0.1 STACK T/H	0
DW-12-11-G-D-300 Samtec, Inc.	CONN HDR 24POS 0.1 STACK T/H	801
FW-20-02-L-D-390-100 Samtec, Inc.	CONN HDR 40POS 0.05 STACK T/H	0
FW-05-02-G-D-200-150 Samtec, Inc.	CONN HDR 10POS 0.05 STACK T/H	0
DW-05-07-T-S-230-004 Samtec, Inc.	CONN HDR 5POS 0.1 STACK T/H TIN	536

Rectangular Connectors - Board Spacers, Stackers (Board to Board)

1. Overview

Rectangular board spacers and stackers are interconnect solutions designed to establish mechanical and electrical connections between two or more printed circuit boards (PCBs). These connectors maintain precise spacing while enabling signal/power transmission. Their importance in modern electronics includes enabling compact designs, modular system architectures, and reliable high-speed data transfer in applications ranging from consumer devices to industrial equipment.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Board Spacers	Fixed pitch, non-mating interconnects with insulating pillars	Smartphone mid-frames, IoT sensor modules
Stacking Connectors	Self-mating design with compressible contacts	Embedded computing boards, FPGA development kits
High-Speed Stackers	Controlled impedance, low crosstalk design	5G base stations, network switches
Compliant Pin Stackers	Press-fit terminations for Z-axis compliance	Automotive radar systems, medical imaging devices

3. Structure and Components

Typical construction includes:

Insulating housing (LCP/PBT with UL94 V-0 rating)
Phosphor bronze or beryllium copper contacts
Gold-plated contact areas (0.5-3 m thickness)
Polarization keying to prevent misalignment
Integrated locking mechanisms (latches/snap-fits)
Optional EMI shielding layers

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	0.5A - 5A per contact	Dictates power delivery capability
Contact Resistance	5-20m	Impacts signal integrity
Dielectric Strength	500V - 2500V AC	Ensures electrical safety
Operating Temperature	-55 C to +125 C	Determines environmental robustness
Insertion Force	0.5N - 5N per contact	Affects assembly process
Mating Cycles	500 - 10,000 cycles	Defines service life expectancy

5. Application Fields

Telecommunications: Server backplanes, 5G NR radios
Industrial Automation: PLC modules, CNC controller stacks
Consumer Electronics: Foldable device hinge connectors
Medical Devices: MRI system detector arrays
Automotive: ADAS sensor stacking modules

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	SMART Board Stacker	12 Gbps capability, self-aligning
Molex	Impel High-Speed Connector	25+ Gbps, floating compliance
Amphenol	CBGA Interposer	Micro BGA footprint compatibility
JAE Electronics	DF59 Series	0.4mm pitch, 0.3mm stack height

7. Selection Recommendations

Key considerations:

Electrical requirements vs. contact density needs
Stack height tolerance stack-up analysis
Thermal expansion coefficient matching
Field serviceability requirements
Automated optical inspection (AOI) compatibility

Case Study: In automotive camera module design, compliant pin stackers reduced assembly time by 40% while maintaining ISO 16750 vibration compliance.

8. Industry Trends

Migration to 0.3mm pitch connectors for mobile applications
Integration of coaxial contacts for RF board-to-board links
Adoption of additive manufacturing for complex shapes
Increased adoption of press-fit terminations in harsh environments
Development of hybrid optical-electrical stacking solutions