Rectangular Connectors - Board In, Direct Wire to Board

Image	Part Number	Description / PDF	Quantity	Rfq
	0521511010 Woodhead - Molex	CONN RCPT POKE-IN 10POS PCB RA	0
	0915772310 Woodhead - Molex	CONN DIP HDR IDC 10POS 28AWG PCB	0
	0521471410 Woodhead - Molex	CONN IDC POKE-IN 14POS 26AWG PCB	0
	0520110210 Woodhead - Molex	CONN IDC POKE 2P 24-26AWG VERT	0
	0510220200 Woodhead - Molex	CONN HSG CRIMP 2POS	0
	0905842308 Woodhead - Molex	CONN DIP HDR IDC 8P 26-28AWG PCB	0
	0915771306 Woodhead - Molex	CONN DIP HDR IDC 6POS 28AWG PCB	0
	0510151100 Woodhead - Molex	CONN HSG CRIMP 11POS	0
	0915771304 Woodhead - Molex	CONN DIP HDR IDC 4POS 28AWG PCB	0
	0521511710 Woodhead - Molex	CONN RCPT POKE-IN 17POS PCB RA	0
	0510151500 Woodhead - Molex	CONN HSG CRIMP 15POS	0
	0905842304 Woodhead - Molex	CONN DIP HDR IDC 4P 26-28AWG PCB	0
	0521471710 Woodhead - Molex	CONN IDC POKE-IN 17POS 26AWG PCB	0
	0521511210 Woodhead - Molex	CONN RCPT POKE-IN 12POS PCB RA	0
	0521511310 Woodhead - Molex	CONN RCPT POKE-IN 13POS PCB RA	0
	0905842306 Woodhead - Molex	CONN DIP HDR IDC 6P 26-28AWG PCB	0
	0510220500 Woodhead - Molex	CONN HSG CRIMP 5POS	0
	0510220300 Woodhead - Molex	CONN HSG CRIMP 3POS	0
	0510220900 Woodhead - Molex	CONN HSG CRIMP 9POS	0
	0521510910 Woodhead - Molex	CONN RCPT POKE 9P 26AWG PCB RA	0

Rectangular Connectors - Board In, Direct Wire to Board

1. Overview

Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Vertical Board In	Perpendicular PCB stacking with high mating force tolerance	Smartphones, industrial control panels
Right-Angle Board In	90 PCB interconnection for space-constrained designs	Automotive infotainment systems
Direct Wire to Board (Crimp)	Field-terminable contacts with crimped wire connections	Home appliances, medical devices
Direct Wire to Board (Solder)	High-reliability solder terminations for fixed wiring	Aerospace electronics, test equipment

3. Structure and Components

Typical construction includes:

Insulating Housing: Thermoplastic (e.g., LCP, PBT) or thermoset materials with UL94 V-0 flammability rating
Contact Elements: Phosphor bronze or beryllium copper with Au/Ni plating (0.05-0.76 m Au thickness)
Polarization Features: Keying slots and color coding for mating assurance
Retention Mechanism: Integral latches or threaded hardware (M2-M4 screws)
Shielding: Optional EMI suppression via stamped metal cans (100MHz-10GHz attenuation)

4. Key Technical Specifications

Parameter	Significance	Typical Values
Current Rating	Determines power transmission capacity	0.5A-15A/contact
Dielectric Withstanding Voltage	Safety isolation performance	500VAC-2500VAC
Contact Resistance	Signal integrity indicator	5-20m (initial)
Operating Temperature	Environmental durability range	-55 C to +125 C
Mating Cycle Life	Long-term reliability metric	500-10,000 cycles

5. Application Fields

Consumer Electronics: Laptop docking stations, gaming consoles
Automotive: Powertrain control modules, ADAS sensors
Industrial: PLC racks, CNC machine interfaces
Medical: Diagnostic imaging equipment, patient monitors

Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.

6. Leading Manufacturers and Representative Products

Manufacturer	Product Line	Key Specifications
TE Connectivity	MicroSpeed Direct Wire	0.8mm pitch, 3Gbps data rate, 1000V isolation
Molex	SlimStack Wire-to-Board	1.25mm pitch, 3A current, 200 cycle durability
Amphenol	ECOS Board In	Surface-mount compliant, 1.0mm wire capacity

7. Selection Guidelines

Key considerations include:

Current/voltage requirements vs. contact cross-section area
Wire gauge compatibility (typically 30-16AWG)
Environmental sealing needs (IP65+ for industrial applications)
Automated assembly compatibility (press-fit vs. solder options)
Signal integrity requirements (impedance control for >1Gbps applications)

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for wearable devices
High-Speed Transmission: Differential pair designs supporting USB4/PCIe 5.0
Material Innovation: Biodegradable PBT for RoHS compliance
Smart Manufacturing: Embedded sensors for predictive maintenance
Automotive Focus: 800V EV connector systems with active thermal management