Rectangular Connectors - Board In, Direct Wire to Board

Image Part Number Description / PDF Quantity Rfq
3422-0000T

3422-0000T

3M

CONN IDC 20POS 26-28AWG VERT

303

7864-0000PR

7864-0000PR

3M

CONN DIP HDR IDC 64P VERT

0

7850-0000PR

7850-0000PR

3M

CONN DIP HDR IDC 50P VERT

298

7810-0000PR

7810-0000PR

3M

CONN DIP HDR IDC 10P VERT

0

3434-0000

3434-0000

3M

CONN IDC 26POS 26-28AWG VERT

45

7860-0000PR

7860-0000PR

3M

CONN DIP HDR IDC 60P VERT

0

7820-0000PR

7820-0000PR

3M

CONN DIP HDR IDC 20P VERT

844

3474-0000T

3474-0000T

3M

CONN IDC 10POS 26-28AWG VERT

0

7840-0000PR

7840-0000PR

3M

CONN DIP HDR IDC 40P VERT

96

7834-0000PR

7834-0000PR

3M

CONN DIP HDR IDC 34P VERT

407

7830-0000PR

7830-0000PR

3M

CONN DIP HDR IDC 30P VERT

0

7826-0000PR

7826-0000PR

3M

CONN DIP HDR IDC 26P VERT

36

3434-0000T

3434-0000T

3M

CONN IDC 26POS 26-28AWG VERT

508

7814-0000PR

7814-0000PR

3M

CONN DIP HDR IDC 14P VERT

0

7816-0000PR

7816-0000PR

3M

CONN DIP HDR IDC 16P VERT

68

99436-0016T

99436-0016T

3M

CONN DIP HDR IDC 36P 28AWG VERT

0

3426-0000T

3426-0000T

3M

CONN IDC 50POS 26-28AWG VERT

0

99430-0016T

99430-0016T

3M

CONN DIP HDR IDC 30P 28AWG VERT

0

99440-0016T

99440-0016T

3M

CONN DIP HDR IDC 40P 28AWG VERT

0

7814-0006PR

7814-0006PR

3M

CONN DIP HDR IDC 14P VERT

0

Rectangular Connectors - Board In, Direct Wire to Board

1. Overview

Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Vertical Board InPerpendicular PCB stacking with high mating force toleranceSmartphones, industrial control panels
Right-Angle Board In90 PCB interconnection for space-constrained designsAutomotive infotainment systems
Direct Wire to Board (Crimp)Field-terminable contacts with crimped wire connectionsHome appliances, medical devices
Direct Wire to Board (Solder)High-reliability solder terminations for fixed wiringAerospace electronics, test equipment

3. Structure and Components

Typical construction includes:

  • Insulating Housing: Thermoplastic (e.g., LCP, PBT) or thermoset materials with UL94 V-0 flammability rating
  • Contact Elements: Phosphor bronze or beryllium copper with Au/Ni plating (0.05-0.76 m Au thickness)
  • Polarization Features: Keying slots and color coding for mating assurance
  • Retention Mechanism: Integral latches or threaded hardware (M2-M4 screws)
  • Shielding: Optional EMI suppression via stamped metal cans (100MHz-10GHz attenuation)

4. Key Technical Specifications

ParameterSignificanceTypical Values
Current RatingDetermines power transmission capacity0.5A-15A/contact
Dielectric Withstanding VoltageSafety isolation performance500VAC-2500VAC
Contact ResistanceSignal integrity indicator5-20m (initial)
Operating TemperatureEnvironmental durability range-55 C to +125 C
Mating Cycle LifeLong-term reliability metric500-10,000 cycles

5. Application Fields

  • Consumer Electronics: Laptop docking stations, gaming consoles
  • Automotive: Powertrain control modules, ADAS sensors
  • Industrial: PLC racks, CNC machine interfaces
  • Medical: Diagnostic imaging equipment, patient monitors

Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.

6. Leading Manufacturers and Representative Products

ManufacturerProduct LineKey Specifications
TE ConnectivityMicroSpeed Direct Wire0.8mm pitch, 3Gbps data rate, 1000V isolation
MolexSlimStack Wire-to-Board1.25mm pitch, 3A current, 200 cycle durability
AmphenolECOS Board InSurface-mount compliant, 1.0mm wire capacity

7. Selection Guidelines

Key considerations include:

  • Current/voltage requirements vs. contact cross-section area
  • Wire gauge compatibility (typically 30-16AWG)
  • Environmental sealing needs (IP65+ for industrial applications)
  • Automated assembly compatibility (press-fit vs. solder options)
  • Signal integrity requirements (impedance control for >1Gbps applications)

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for wearable devices
  • High-Speed Transmission: Differential pair designs supporting USB4/PCIe 5.0
  • Material Innovation: Biodegradable PBT for RoHS compliance
  • Smart Manufacturing: Embedded sensors for predictive maintenance
  • Automotive Focus: 800V EV connector systems with active thermal management
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