Rectangular Connectors - Board In, Direct Wire to Board

Part Number	Description / PDF	Quantity
0905841326 Woodhead - Molex	CONN DIP HDR IDC 26POS PCB	0
10DB-6S(LF) JST	CONN WIRE IDC 10POS 24-28AWG PCB	0
DF4-8DP-2C Hirose	CONN HSG CRIMP 8POS	0
009296004503906 Elco (AVX)	CONN WIR POKE-IN 4P 18-26AWG SMD	1646
5746613-1 TE Connectivity AMP Connectors	CONN DIP HDR IDC 8POS VERT	907
2-173983-8 TE Connectivity AMP Connectors	CONN WIRE IDC 8P 26-28AWG PCB RA	2136
0510150600 Woodhead - Molex	CONN HSG CRIMP 6POS	27641
0510150500 Woodhead - Molex	CONN HSG CRIMP 5POS	7435
AWLP 30/3,2-T ASSMANN WSW Components	CONN DIP HDR IDC 30POS VERT	0
3-173985-0 TE Connectivity AMP Connectors	CONN WIRE IDC 10P 26-28AWG VERT	6289
3-173983-0 TE Connectivity AMP Connectors	CONN WIR IDC 10P 26-28AWG PCB RA	0
2106489-2 TE Connectivity AMP Connectors	CONN WIRE IDC 2POS 18AWG PCB RA	0
2-2178713-0 TE Connectivity AMP Connectors	CONN DIP HDR IDC 20POS VERT	0
174453-3 TE Connectivity AMP Connectors	CONN HDR IDC 3P 26-28AWG PCB RA	0
DF4-7P-2C Hirose	CONN HSG CRIMP 7POS	267
3240-16-00 CnC Tech	CONN DIP PLG IDC 16POS VERT	1509
009176003722106 Elco (AVX)	CONN WIRE IDC 3POS 22AWG SMD	2400
009296002503906 Elco (AVX)	CONN WIR POKE-IN 2P 18-26AWG SMD	431730800
1-111382-4 TE Connectivity AMP Connectors	CONN DIP HDR IDC 10POS PCB	1491
AWLP 14/3,2-T ASSMANN WSW Components	CONN DIP HDR IDC 14POS VERT	0

Rectangular Connectors - Board In, Direct Wire to Board

1. Overview

Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Vertical Board In	Perpendicular PCB stacking with high mating force tolerance	Smartphones, industrial control panels
Right-Angle Board In	90 PCB interconnection for space-constrained designs	Automotive infotainment systems
Direct Wire to Board (Crimp)	Field-terminable contacts with crimped wire connections	Home appliances, medical devices
Direct Wire to Board (Solder)	High-reliability solder terminations for fixed wiring	Aerospace electronics, test equipment

3. Structure and Components

Typical construction includes:

Insulating Housing: Thermoplastic (e.g., LCP, PBT) or thermoset materials with UL94 V-0 flammability rating
Contact Elements: Phosphor bronze or beryllium copper with Au/Ni plating (0.05-0.76 m Au thickness)
Polarization Features: Keying slots and color coding for mating assurance
Retention Mechanism: Integral latches or threaded hardware (M2-M4 screws)
Shielding: Optional EMI suppression via stamped metal cans (100MHz-10GHz attenuation)

4. Key Technical Specifications

Parameter	Significance	Typical Values
Current Rating	Determines power transmission capacity	0.5A-15A/contact
Dielectric Withstanding Voltage	Safety isolation performance	500VAC-2500VAC
Contact Resistance	Signal integrity indicator	5-20m (initial)
Operating Temperature	Environmental durability range	-55 C to +125 C
Mating Cycle Life	Long-term reliability metric	500-10,000 cycles

5. Application Fields

Consumer Electronics: Laptop docking stations, gaming consoles
Automotive: Powertrain control modules, ADAS sensors
Industrial: PLC racks, CNC machine interfaces
Medical: Diagnostic imaging equipment, patient monitors

Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.

6. Leading Manufacturers and Representative Products

Manufacturer	Product Line	Key Specifications
TE Connectivity	MicroSpeed Direct Wire	0.8mm pitch, 3Gbps data rate, 1000V isolation
Molex	SlimStack Wire-to-Board	1.25mm pitch, 3A current, 200 cycle durability
Amphenol	ECOS Board In	Surface-mount compliant, 1.0mm wire capacity

7. Selection Guidelines

Key considerations include:

Current/voltage requirements vs. contact cross-section area
Wire gauge compatibility (typically 30-16AWG)
Environmental sealing needs (IP65+ for industrial applications)
Automated assembly compatibility (press-fit vs. solder options)
Signal integrity requirements (impedance control for >1Gbps applications)

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for wearable devices
High-Speed Transmission: Differential pair designs supporting USB4/PCIe 5.0
Material Innovation: Biodegradable PBT for RoHS compliance
Smart Manufacturing: Embedded sensors for predictive maintenance
Automotive Focus: 800V EV connector systems with active thermal management