Rectangular Connectors - Board In, Direct Wire to Board

Part Number	Description / PDF	Quantity
0905841318 Woodhead - Molex	CONN DIP HDR IDC 18POS PCB	1064
3040-20-00 CnC Tech	CONN DIP PLG IDC 20POS VERT	10293
3-2106431-4 TE Connectivity AMP Connectors	CONN WIRE IDC 4POS 24AWG SMD RA	3919
DF4-12P-2C Hirose	CONN HSG CRIMP 12POS	0
AWLP 26/3,2-G ASSMANN WSW Components	CONN DIP HDR IDC 26POS VERT	1231
AWLP 20/3,2-G ASSMANN WSW Components	CONN DIP HDR IDC 20POS VERT	2984
M50-3801342 Harwin	CONN DIP HDR IDC 26P 30AWG VERT	146
1-215570-4 TE Connectivity AMP Connectors	CONN DIP HDR IDC 14POS 28AWG PCB	0
5111595-9 TE Connectivity AMP Connectors	CONN IDC 40POS VERT	0
0521510610 Woodhead - Molex	CONN RCPT POKE 6P 26AWG PCB RA	11764
009296006202906 Elco (AVX)	CONN WIRE POKE-IN 6POS SMD RA	513
538702206020096 Elco (AVX)	CONN IDC	2000
1658525-7 TE Connectivity AMP Connectors	CONN DIP HDR IDC 14POS VERT	2088
1-215570-6 TE Connectivity AMP Connectors	CONN DIP HDR IDC 16POS 28AWG PCB	0
0521471110 Woodhead - Molex	CONN IDC POKE-IN 11POS 26AWG PCB	1000
5746613-3 TE Connectivity AMP Connectors	CONN DIP HDR IDC 16POS VERT	562
538702104018096 Elco (AVX)	CONN IDC	3000
DF4-12DP-2C Hirose	CONN HSG CRIMP 12POS	0
DF4-4P-2C Hirose	CONN HSG CRIMP 4POS	0
69830-020LF Storage & Server IO (Amphenol ICC)	CONN DIP HDR IDC 20POS VERT	2361

Rectangular Connectors - Board In, Direct Wire to Board

1. Overview

Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Vertical Board In	Perpendicular PCB stacking with high mating force tolerance	Smartphones, industrial control panels
Right-Angle Board In	90 PCB interconnection for space-constrained designs	Automotive infotainment systems
Direct Wire to Board (Crimp)	Field-terminable contacts with crimped wire connections	Home appliances, medical devices
Direct Wire to Board (Solder)	High-reliability solder terminations for fixed wiring	Aerospace electronics, test equipment

3. Structure and Components

Typical construction includes:

Insulating Housing: Thermoplastic (e.g., LCP, PBT) or thermoset materials with UL94 V-0 flammability rating
Contact Elements: Phosphor bronze or beryllium copper with Au/Ni plating (0.05-0.76 m Au thickness)
Polarization Features: Keying slots and color coding for mating assurance
Retention Mechanism: Integral latches or threaded hardware (M2-M4 screws)
Shielding: Optional EMI suppression via stamped metal cans (100MHz-10GHz attenuation)

4. Key Technical Specifications

Parameter	Significance	Typical Values
Current Rating	Determines power transmission capacity	0.5A-15A/contact
Dielectric Withstanding Voltage	Safety isolation performance	500VAC-2500VAC
Contact Resistance	Signal integrity indicator	5-20m (initial)
Operating Temperature	Environmental durability range	-55 C to +125 C
Mating Cycle Life	Long-term reliability metric	500-10,000 cycles

5. Application Fields

Consumer Electronics: Laptop docking stations, gaming consoles
Automotive: Powertrain control modules, ADAS sensors
Industrial: PLC racks, CNC machine interfaces
Medical: Diagnostic imaging equipment, patient monitors

Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.

6. Leading Manufacturers and Representative Products

Manufacturer	Product Line	Key Specifications
TE Connectivity	MicroSpeed Direct Wire	0.8mm pitch, 3Gbps data rate, 1000V isolation
Molex	SlimStack Wire-to-Board	1.25mm pitch, 3A current, 200 cycle durability
Amphenol	ECOS Board In	Surface-mount compliant, 1.0mm wire capacity

7. Selection Guidelines

Key considerations include:

Current/voltage requirements vs. contact cross-section area
Wire gauge compatibility (typically 30-16AWG)
Environmental sealing needs (IP65+ for industrial applications)
Automated assembly compatibility (press-fit vs. solder options)
Signal integrity requirements (impedance control for >1Gbps applications)

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for wearable devices
High-Speed Transmission: Differential pair designs supporting USB4/PCIe 5.0
Material Innovation: Biodegradable PBT for RoHS compliance
Smart Manufacturing: Embedded sensors for predictive maintenance
Automotive Focus: 800V EV connector systems with active thermal management