Rectangular Connectors - Board In, Direct Wire to Board

Part Number	Description / PDF	Quantity
DF4-28DP-2C Hirose	CONN HSG CRIMP 28POS	0
3422-0000T 3M	CONN IDC 20POS 26-28AWG VERT	303
0510150800 Woodhead - Molex	CONN HSG CRIMP 8POS	2359
0905841304 Woodhead - Molex	CONN DIP HDR IDC 4P 26-28AWG PCB	1314
2-746610-6 TE Connectivity AMP Connectors	CONN DIP HDR IDC 44POS VERT	0
AWLP 10/3,2-T ASSMANN WSW Components	CONN DIP HDR IDC 10POS VERT	0
CWR-130-16-0203 CW Industries	CONN DIP HDR IDC 16POS VERT	5142
009176001884906 Elco (AVX)	CONN WIRE IDC 1POS 28AWG SMD	479
09181209622 HARTING	CONN DIP HDR IDC 20POS VERT	0
XG2A-1402 Omron Electronics Components	CONN DIP HDR IDC 14P 28AWG VERT	0
009176004863906 Elco (AVX)	CONN WIRE IDC 4POS 24AWG SMD	433
09181609622 HARTING	CONN DIP HDR IDC 60POS VERT	15
009296006553906 Elco (AVX)	CONN WIR POKE-IN 6P 18-26AWG SMD	1612
1-216093-0 TE Connectivity AMP Connectors	CONN DIP HDR IDC 10POS VERT	7049
XG2A-2602 Omron Electronics Components	CONN DIP HDR IDC 26P 28AWG VERT	0
1-2106751-2 TE Connectivity AMP Connectors	CONN WIRE IDC 2POS 20AWG PCB RA	281
1-2106751-4 TE Connectivity AMP Connectors	CONN WIRE IDC 4POS 20AWG PCB RA	0
2-173985-4 TE Connectivity AMP Connectors	CONN WIRE IDC 4POS 26-28AWG VERT	0
3-2106751-1 TE Connectivity AMP Connectors	CONN WIRE IDC 1POS 24AWG PCB RA	1604
69830-006LF Storage & Server IO (Amphenol ICC)	CONN DIP HDR IDC 6POS VERT	2370

Rectangular Connectors - Board In, Direct Wire to Board

1. Overview

Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Vertical Board In	Perpendicular PCB stacking with high mating force tolerance	Smartphones, industrial control panels
Right-Angle Board In	90 PCB interconnection for space-constrained designs	Automotive infotainment systems
Direct Wire to Board (Crimp)	Field-terminable contacts with crimped wire connections	Home appliances, medical devices
Direct Wire to Board (Solder)	High-reliability solder terminations for fixed wiring	Aerospace electronics, test equipment

3. Structure and Components

Typical construction includes:

Insulating Housing: Thermoplastic (e.g., LCP, PBT) or thermoset materials with UL94 V-0 flammability rating
Contact Elements: Phosphor bronze or beryllium copper with Au/Ni plating (0.05-0.76 m Au thickness)
Polarization Features: Keying slots and color coding for mating assurance
Retention Mechanism: Integral latches or threaded hardware (M2-M4 screws)
Shielding: Optional EMI suppression via stamped metal cans (100MHz-10GHz attenuation)

4. Key Technical Specifications

Parameter	Significance	Typical Values
Current Rating	Determines power transmission capacity	0.5A-15A/contact
Dielectric Withstanding Voltage	Safety isolation performance	500VAC-2500VAC
Contact Resistance	Signal integrity indicator	5-20m (initial)
Operating Temperature	Environmental durability range	-55 C to +125 C
Mating Cycle Life	Long-term reliability metric	500-10,000 cycles

5. Application Fields

Consumer Electronics: Laptop docking stations, gaming consoles
Automotive: Powertrain control modules, ADAS sensors
Industrial: PLC racks, CNC machine interfaces
Medical: Diagnostic imaging equipment, patient monitors

Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.

6. Leading Manufacturers and Representative Products

Manufacturer	Product Line	Key Specifications
TE Connectivity	MicroSpeed Direct Wire	0.8mm pitch, 3Gbps data rate, 1000V isolation
Molex	SlimStack Wire-to-Board	1.25mm pitch, 3A current, 200 cycle durability
Amphenol	ECOS Board In	Surface-mount compliant, 1.0mm wire capacity

7. Selection Guidelines

Key considerations include:

Current/voltage requirements vs. contact cross-section area
Wire gauge compatibility (typically 30-16AWG)
Environmental sealing needs (IP65+ for industrial applications)
Automated assembly compatibility (press-fit vs. solder options)
Signal integrity requirements (impedance control for >1Gbps applications)

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for wearable devices
High-Speed Transmission: Differential pair designs supporting USB4/PCIe 5.0
Material Innovation: Biodegradable PBT for RoHS compliance
Smart Manufacturing: Embedded sensors for predictive maintenance
Automotive Focus: 800V EV connector systems with active thermal management