Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

Part Number	Description / PDF	Quantity
2384-A120FC3DP1NT-S Oupiin	HIGH SPEED BOARD TO BOARD CONNEC	0
2332-20MG00DPT1-S Oupiin	BOARD TO BOARD, MALE CONNECTOR,	17
2332-40FG00DPT2-S Oupiin	BOARD TO BOARD, 40 PIN, FEMALE C	100
2332-40MG00DPT1-S Oupiin	BOARD TO BOARD, 40 PIN, MALE CON	100
2332-40FG00DPT1-S Oupiin	BOARD TO BOARD, 40 PIN, FEMALE C	100
2384-A120MC3DP1NT Oupiin	HIGH SPEED BOARD TO BOARD CONNEC	0
2384-A120FC3DP1NT-S-TR Oupiin	HIGH SPEED BOARD TO BOARD CONNEC	0
2384-80MC1DPT-S-TR Oupiin	HIGH SPEED BOARD TO BOARD CONNEC	169
2336-60FC3DP1T-S Oupiin	HIGH SPEED BOARD TO BOARD, FEMAL	100
2332-30FG00DPT1-S Oupiin	BOARD TO BOARD, FEMALE CONNECTOR	90
2114-2X33G00S/050/050/JU Oupiin	PIN HEADER, DOUBLE ROW, 66 PIN,	0
2332-30MG00DPT1-S Oupiin	BOARD TO BOARD, MALE CONNECTOR,	43
2332-30FG00DPT2-S Oupiin	BOARD TO BOARD, FEMALE CONNECCTO	100
2345-36TD3AT-M Oupiin	FFC/FPC SOCKET, 36 PIN, TIN PLAT	0
2332-30MG00DPT2-S Oupiin	BOARD TO BOARD, MALE CONNECTOR,	100
2332-20FG00DPT2-S Oupiin	BOARD TO BOARD, FEMALE CONNECTOR	21
2384-A120MC3DP1NT-TR Oupiin	HIGH SPEED BOARD TO BOARD CONNEC	0
2114-2X20G00S/033/044/K Oupiin	PIN HEADER, DOUBLE ROW, 40 PINS,	540
2332-40MG00DPT2-S Oupiin	BOARD TO BOARD, 40 PIN, MALE CON	100
2332-20FG00DPT1-S Oupiin	BOARD TO BOARD, FEMALE CONNECTOR	99

Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

1. Overview

Rectangular connectors are modular electronic components designed to establish electrical connections between subsystems or boards. Arrays, edge type, and mezzanine (board-to-board) connectors enable high-density interconnects in compact spaces. These connectors are critical for modern electronics, supporting miniaturization, high-speed data transfer, and reliable power delivery in applications ranging from consumer devices to industrial systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Array Connectors	High-pin-count designs with parallel signal/power paths; optimized for compactness and thermal management	Backplanes in servers, high-performance computing (HPC) systems
Edge Connectors	Mount directly onto PCB edges; support planar or right-angle configurations	Memory modules (DIMMs), peripheral expansion cards (GPUs)
Mezzanine Connectors	Vertical/horizontal stacking solutions; support board-to-board spacing from 0.8mm to 50mm	Telecom routers, embedded systems (e.g., COM Express modules)

3. Structure and Components

A typical rectangular connector consists of:

Contact Points: Phosphor bronze or beryllium copper alloys with gold/tin plating for low resistance
Insulation Housing: Thermoplastic materials (e.g., LCP, PBT) ensuring dielectric strength and flame resistance
Retention Mechanism: Polarized keys, latches, or friction locks to prevent accidental disconnection
Shielding: Optional EMI protection via metallic shells or conductive coatings

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	0.5A 5A per contact	Determines power-handling capability
Voltage Rating	50V 600V AC/DC	Safety and insulation design
Contact Resistance	5 20 m	Impacts signal integrity and thermal performance
Insulation Resistance	>100 G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Ensures reliability in harsh environments
Mating Cycles	100 10,000 cycles	Defines mechanical durability

5. Application Fields

Telecommunications: 5G base stations, optical network units
Industrial Automation: PLCs, robotic controllers
Medical Devices: MRI scanners, patient monitors
Consumer Electronics: Gaming consoles, notebook computers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	MikroBlast	High-speed mezzanine connector with 12 Gbps capability
Amphenol	Edge	Edge-mount connectors with self-aligning design
Molex	Clarity	Array connector with 0.4mm pitch for mobile devices
Samtec	QSE Series	Self-mating mezzanine connectors for rugged environments

7. Selection Guidelines

When choosing connectors, consider:

Electrical Requirements: Match current/voltage ratings to system needs
Mechanical Constraints: Verify board spacing and alignment tolerances
Environmental Factors: Select materials for temperature, humidity, and vibration resistance
Cost-Performance Balance: Prioritize high-cycle durability for maintenance-prone systems

Example: For a 5G base station, choose a mezzanine connector with 360 shielding and IP67 rating to minimize signal loss and environmental degradation.

8. Industry Trends

Miniaturization: Pitch sizes below 0.4mm to accommodate compact IoT devices
High-Speed Data Transfer: Development of connectors supporting 56 Gbps+ differential signaling
Modular Designs: Hybrid power/signal connectors for flexible system architectures
Sustainability: Adoption of halogen-free materials and recyclable alloys
Smart Manufacturing: Integration of RFID tags in connectors for automated asset tracking