Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

Part Number	Description / PDF	Quantity
FX5-40S2A-DSAL(71) Hirose	CONN RCPT 40POS VERT GOLD	0
DF30FB-34DS-0.4V(81) Hirose	CONN RCPT 34POS SMD GOLD	0
DF9B-25S-1V(32) Hirose	CONN RCPT 25POS SMD TIN	8447
ER8-30S-0.8SV-5H Hirose	CONN RCPT 30POS SMD GOLD	189
ER8-10S-0.8SV-5H Hirose	CONN RCPT 10POS SMD GOLD	142
BM10NB(0.8)-16DS-0.4V(51) Hirose	CONN RCPT 16POS SMD GOLD	2652
FX10A-120P-SV1(71) Hirose	CONN HDR 120POS SMD GOLD	0
DF17(2.0)-30DP-0.5V(57) Hirose	CONN HDR 30POS SMD GOLD	196
DF40C-24DP-0.4V(51) Hirose	CONN PLUG 24POS SMD GOLD	22783
BM10B(0.8)-20DP-0.4V(51) Hirose	CONN HDR 20POS SMD GOLD	0
BM28B0.6-34DS/2-0.35V(53) Hirose	CONN RCPT 34POS SMD GOLD	979
FX10B-140P/14-SV1(71) Hirose	CONN HDR 140POS SMD GOLD	0
BM14B(0.8)-60DS-0.4V(53) Hirose	CONN RCPT 60POS SMD GOLD	248
DF12NB(4.0)-36DP-0.5V(51) Hirose	CONN HDR 36POS SMD GOLD	952
FX12B-60S-0.4SV Hirose	CONN RCPT 60POS SMD GOLD	1674
DF37B-16DP-0.4V(53) Hirose	CONN HDR 16POS SMD GOLD	433
BM14B(0.8)-30DS-0.4V(52) Hirose	CONN RCPT 30POS SMD GOLD	0
DF15B(6.2)-40DP-0.65V(56) Hirose	CONN HDR 40POS SMD GOLD	0
DF30FB-30DS-0.4V(81) Hirose	CONN RCPT 30POS SMD GOLD	0
DF40HC(3.5)-80DS-0.4V(51) Hirose	CONN RCPT 80POS SMD GOLD	1681

Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

1. Overview

Rectangular connectors are modular electronic components designed to establish electrical connections between subsystems or boards. Arrays, edge type, and mezzanine (board-to-board) connectors enable high-density interconnects in compact spaces. These connectors are critical for modern electronics, supporting miniaturization, high-speed data transfer, and reliable power delivery in applications ranging from consumer devices to industrial systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Array Connectors	High-pin-count designs with parallel signal/power paths; optimized for compactness and thermal management	Backplanes in servers, high-performance computing (HPC) systems
Edge Connectors	Mount directly onto PCB edges; support planar or right-angle configurations	Memory modules (DIMMs), peripheral expansion cards (GPUs)
Mezzanine Connectors	Vertical/horizontal stacking solutions; support board-to-board spacing from 0.8mm to 50mm	Telecom routers, embedded systems (e.g., COM Express modules)

3. Structure and Components

A typical rectangular connector consists of:

Contact Points: Phosphor bronze or beryllium copper alloys with gold/tin plating for low resistance
Insulation Housing: Thermoplastic materials (e.g., LCP, PBT) ensuring dielectric strength and flame resistance
Retention Mechanism: Polarized keys, latches, or friction locks to prevent accidental disconnection
Shielding: Optional EMI protection via metallic shells or conductive coatings

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	0.5A 5A per contact	Determines power-handling capability
Voltage Rating	50V 600V AC/DC	Safety and insulation design
Contact Resistance	5 20 m	Impacts signal integrity and thermal performance
Insulation Resistance	>100 G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Ensures reliability in harsh environments
Mating Cycles	100 10,000 cycles	Defines mechanical durability

5. Application Fields

Telecommunications: 5G base stations, optical network units
Industrial Automation: PLCs, robotic controllers
Medical Devices: MRI scanners, patient monitors
Consumer Electronics: Gaming consoles, notebook computers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	MikroBlast	High-speed mezzanine connector with 12 Gbps capability
Amphenol	Edge	Edge-mount connectors with self-aligning design
Molex	Clarity	Array connector with 0.4mm pitch for mobile devices
Samtec	QSE Series	Self-mating mezzanine connectors for rugged environments

7. Selection Guidelines

When choosing connectors, consider:

Electrical Requirements: Match current/voltage ratings to system needs
Mechanical Constraints: Verify board spacing and alignment tolerances
Environmental Factors: Select materials for temperature, humidity, and vibration resistance
Cost-Performance Balance: Prioritize high-cycle durability for maintenance-prone systems

Example: For a 5G base station, choose a mezzanine connector with 360 shielding and IP67 rating to minimize signal loss and environmental degradation.

8. Industry Trends

Miniaturization: Pitch sizes below 0.4mm to accommodate compact IoT devices
High-Speed Data Transfer: Development of connectors supporting 56 Gbps+ differential signaling
Modular Designs: Hybrid power/signal connectors for flexible system architectures
Sustainability: Adoption of halogen-free materials and recyclable alloys
Smart Manufacturing: Integration of RFID tags in connectors for automated asset tracking