Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

Part Number	Description / PDF	Quantity
BSE-020-01-L-D-A-FL-TR Samtec, Inc.	CONN RCPT 40POS SMD GOLD	0
ST4-30-2.50-L-D-P-TR Samtec, Inc.	CONN HDR 60POS SMD GOLD	0
BTH-060-02-L-D-LC-K-TR Samtec, Inc.	CONN HDR 120POS SMD GOLD	0
BTE-020-01-L-D-EM2-GP Samtec, Inc.	CONN HDR 40POS EDGE MNT GOLD	0
BTH-150-06-L-D Samtec, Inc.	CONN HDR 300POS SMD GOLD	0
SEAM-10-07.0-S-04-1-A-K-TR Samtec, Inc.	CONN HD ARRAY PLUG 40P SMD GOLD	0
BSE-090-01-L-D-A Samtec, Inc.	CONN RCPT 180POS SMD GOLD	0
QTH-060-01-C-D-A-K Samtec, Inc.	CONN HDR 120POS SMD GOLD	0
SEAM-40-11.0-L-08-2-A-K-TR Samtec, Inc.	CONN HD ARRAY PLUG 320P SMD GOLD	0
YFS-20-03-H-05-SB-K-TR Samtec, Inc.	CONN ARRAY RCPT 100POS SMD GOLD	171
SEAF-20-06.5-S-04-2-A-K-TR Samtec, Inc.	CONN HD ARRAY RCPT 80P SMD GOLD	279
QSH-060-01-H-D-DP-A Samtec, Inc.	CONN DIFF ARRAY RCPT 120POS SMD	0
LSHM-140-01-F-DH-A-S-K-TR Samtec, Inc.	CONN SELF-MATE 80P R/A SMD GOLD	825
SEAF-50-01-L-08-1-RA-K-TR Samtec, Inc.	CONN HD ARRAY RCPT 400P R/A SMD	0
SEAM-30-02.0-L-04-2-A-K-TR Samtec, Inc.	CONN HD ARRAY PLUG 120P SMD GOLD	467
SEAF-50-06.0-S-04-2-A-K-TR Samtec, Inc.	CONN HD ARRAY RCPT 200P SMD GOLD	0
BTE-080-04-F-D-A-K-TR Samtec, Inc.	CONN HDR 160POS SMD GOLD	0
SEAF-50-06.0-L-08-1-A-K-TR Samtec, Inc.	CONN HD ARRAY RCPT 400P SMD GOLD	0
SEAM-40-03.5-L-10-1-A-K-TR Samtec, Inc.	CONN HD ARRAY PLUG 400P SMD GOLD	123
SEAF-40-06.0-S-10-2-A-K-TR Samtec, Inc.	CONN HD ARRAY RCPT 400P SMD GOLD	103

Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

1. Overview

Rectangular connectors are modular electronic components designed to establish electrical connections between subsystems or boards. Arrays, edge type, and mezzanine (board-to-board) connectors enable high-density interconnects in compact spaces. These connectors are critical for modern electronics, supporting miniaturization, high-speed data transfer, and reliable power delivery in applications ranging from consumer devices to industrial systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Array Connectors	High-pin-count designs with parallel signal/power paths; optimized for compactness and thermal management	Backplanes in servers, high-performance computing (HPC) systems
Edge Connectors	Mount directly onto PCB edges; support planar or right-angle configurations	Memory modules (DIMMs), peripheral expansion cards (GPUs)
Mezzanine Connectors	Vertical/horizontal stacking solutions; support board-to-board spacing from 0.8mm to 50mm	Telecom routers, embedded systems (e.g., COM Express modules)

3. Structure and Components

A typical rectangular connector consists of:

Contact Points: Phosphor bronze or beryllium copper alloys with gold/tin plating for low resistance
Insulation Housing: Thermoplastic materials (e.g., LCP, PBT) ensuring dielectric strength and flame resistance
Retention Mechanism: Polarized keys, latches, or friction locks to prevent accidental disconnection
Shielding: Optional EMI protection via metallic shells or conductive coatings

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	0.5A 5A per contact	Determines power-handling capability
Voltage Rating	50V 600V AC/DC	Safety and insulation design
Contact Resistance	5 20 m	Impacts signal integrity and thermal performance
Insulation Resistance	>100 G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Ensures reliability in harsh environments
Mating Cycles	100 10,000 cycles	Defines mechanical durability

5. Application Fields

Telecommunications: 5G base stations, optical network units
Industrial Automation: PLCs, robotic controllers
Medical Devices: MRI scanners, patient monitors
Consumer Electronics: Gaming consoles, notebook computers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TE Connectivity	MikroBlast	High-speed mezzanine connector with 12 Gbps capability
Amphenol	Edge	Edge-mount connectors with self-aligning design
Molex	Clarity	Array connector with 0.4mm pitch for mobile devices
Samtec	QSE Series	Self-mating mezzanine connectors for rugged environments

7. Selection Guidelines

When choosing connectors, consider:

Electrical Requirements: Match current/voltage ratings to system needs
Mechanical Constraints: Verify board spacing and alignment tolerances
Environmental Factors: Select materials for temperature, humidity, and vibration resistance
Cost-Performance Balance: Prioritize high-cycle durability for maintenance-prone systems

Example: For a 5G base station, choose a mezzanine connector with 360 shielding and IP67 rating to minimize signal loss and environmental degradation.

8. Industry Trends

Miniaturization: Pitch sizes below 0.4mm to accommodate compact IoT devices
High-Speed Data Transfer: Development of connectors supporting 56 Gbps+ differential signaling
Modular Designs: Hybrid power/signal connectors for flexible system architectures
Sustainability: Adoption of halogen-free materials and recyclable alloys
Smart Manufacturing: Integration of RFID tags in connectors for automated asset tracking