Pluggable Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
36310-3200-008

36310-3200-008

3M

CONN BACKSHELL FOR SCR CONN

2

36310-F200-008

36310-F200-008

3M

CONN BACKSHELL FOR SCR CONN

124

8B36-1420

8B36-1420

3M

CONN BACKSHELL FOR MINISAS CONN

0

8B36-1410

8B36-1410

3M

CONN BACKSHELL FOR MINISAS CONN

0

8B36-2421

8B36-2421

3M

CONN BACKSHELL FOR MINISAS CONN

0

8B36-2411

8B36-2411

3M

CONN BACKSHELL FOR MINISAS CONN

0

Pluggable Connectors - Accessories

1. Overview

Pluggable connectors and their accessories are modular electronic components designed to enable rapid, tool-free connection and disconnection of electrical circuits. They serve as critical interfaces in systems requiring maintenance flexibility, scalability, and high reliability. These components are essential in telecommunications, data centers, industrial automation, and consumer electronics, where they ensure seamless signal and power transmission while minimizing downtime during upgrades or repairs.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Fiber Optic Connectors (LC, SC, MPO)High-speed optical signal transmission, low insertion lossData center backbone networks, 5G infrastructure
Copper Cable Connectors (RJ45, USB-C)Power and data transmission over twisted pair or coaxial cablesEthernet switches, IoT devices
High-Speed Backplane ConnectorsDifferential signaling with impedance control for >25 Gbps ratesTelecom routers, military radar systems
Modular Adapter PanelsInterface conversion (e.g., SC to LC), density optimizationHybrid network cabinets, test equipment

3. Structure & Composition

Typical pluggable connectors consist of:

  • Contact Elements: Phosphor bronze or beryllium copper with gold/silver plating for conductivity
  • Insulation Housing: High-temperature resistant LCP or nylon for dimensional stability
  • Shielding Shell: Metal (aluminum, steel) or conductive polymer for EMI protection
  • Latching Mechanism: Push-pull, bayonet, or threaded coupling for secure mating

4. Key Technical Specifications

ParameterImportance
Insertion Loss ( 0.5 dB)Determines signal integrity in high-frequency applications
Voltage Standing Wave Ratio (VSWR 1.5:1)Indicates impedance matching quality
Operating Temperature (-55 C to +125 C)Defines environmental durability limits
Mating Cycles ( 500 cycles)Directly impacts maintenance lifecycle costs
Current Carrying Capacity (1-10A per contact)Dictates power delivery capabilities

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical line terminals
  • Data Centers: 400Gbps QSFP-DD interconnects, storage area networks
  • Industrial Automation: Programmable logic controllers (PLCs), sensor hubs
  • Medical Equipment: MRI machine data links, patient monitoring systems

Case Study: Google's AI server clusters utilize 800Gbps OSFP connectors for GPU interlinks, achieving 40% lower latency compared to traditional QSFP designs.

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
TE ConnectivityMULTI-BEAM X High-Speed I/O Connector
AmphenolOpti-Speed Active Optical Cable Assembly
MolexPeregrine 112Gbps Backplane System
3MFiber Optic LX.5 Connector for 400G Ethernet

7. Selection Recommendations

Key considerations:

  • Application Requirements: Signal type (analog/digital), frequency range, power needs
  • Environmental Factors: Vibration resistance, corrosion protection (IP67-rated for outdoor use)
  • Standards Compliance: IEEE 802.3bs (400G Ethernet), RoHS, REACH
  • Total Cost of Ownership: Evaluate connector durability against replacement frequency

8. Industry Trends

Emerging developments include:

  • Transition to 1.6Tbps+ optical engines with silicon photonics integration
  • Adoption of liquid cooling compatible connectors for high-density server racks
  • AI-driven predictive maintenance systems using embedded connector sensors
  • Miniaturization (e.g., SFP-DD to OSFP-XD size reduction) for 800G+ modules
  • Increased use of composite materials to reduce weight in aerospace applications
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