Pluggable Connectors

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145650007002896+

145650007002896+

KYOCERA Corporation

BOARD TO BOARD

0

245650022003872+

245650022003872+

KYOCERA Corporation

BOARD TO BOARD

0

295650022002872+

295650022002872+

KYOCERA Corporation

BOARD TO BOARD

0

145650013002896+

145650013002896+

KYOCERA Corporation

BOARD TO BOARD

0

145650007000896+

145650007000896+

KYOCERA Corporation

BOARD TO BOARD

0

145650013001896+

145650013001896+

KYOCERA Corporation

BOARD TO BOARD

0

155650013002896+

155650013002896+

KYOCERA Corporation

BOARD TO BOARD

0

245650022001872+

245650022001872+

KYOCERA Corporation

BOARD TO BOARD

0

Pluggable Connectors

1. Overview

Pluggable connectors are modular electronic interfaces enabling rapid connection/disconnection of circuits in high-speed data transmission systems. As critical components in modern communication infrastructure, they support hot-swapping capabilities while maintaining signal integrity. These connectors serve as standardized interfaces between devices, cables, and PCBs, playing essential roles in telecommunications, data centers, and industrial automation.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Fiber Optic ConnectorsSupports 10Gbps-400Gbps transmission, LC/MPO interfaces, low insertion lossData center backbone networks
Copper Cage ConnectorsShielded modular design, supports 1Gbps-100Gbps, thermal management featuresSwitch/router panel interfaces
High-Speed BackplaneDifferential pair architecture, impedance-controlled, multi-gigabit per laneTelecom equipment chassis
M12/X-coded ConnectorsIndustrial Ethernet, IP67 rated, vibration-resistantFactory automation systems

3. Structure and Components

Typical pluggable connectors consist of: - Housing: Latch-equipped polymer casing (UL94 V-0 rated) - Contacts: Gold-plated phosphor bronze with 0.1-0.2N contact force - Insulation: High-temperature resistant PBT/GF materials - Termination: Solder tails or press-fit pins (10-40 positions) - Shielding: 360 EMI protection with drain wire connection - Keying: Mechanical polarization to prevent mismatch insertion

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance5-20 m Directly affects power loss
Insulation Resistance>10^9 Safety and signal isolation
VSWR<1.5:1 @50GHzMicrowave signal integrity
Operating Temp-55 C to +125 CEnvironmental reliability
Mating Cycles500-1000 cyclesLifetime durability

5. Application Fields

  • Telecommunications: 5G base stations (eCPRI interfaces), DWDM systems
  • Data Centers: Top-of-Rack switches using QSFP28/OSFP modules
  • Industrial: PROFINET-enabled machinery with M12 connectors
  • Transportation: Automotive Ethernet in autonomous vehicles (100BASE-T1)
  • Medical: MRI machines requiring sterile electrical interfaces

6. Leading Manufacturers and Products

ManufacturerKey ProductsSpecialization
Amphenol ICCOptiMux fiber arraysHigh-density optical
TE ConnectivityMATRIXall backplaneHarsh environment
MolexOSFP800 Series800Gbps solutions
SamtecFireFly optical enginesMid-board optical

7. Selection Guidelines

Key considerations: - Signal bandwidth requirements (Nyquist frequency calculation) - Environmental factors (temperature/humidity/chemical exposure) - Compliance with industry standards (IEEE 802.3bs, IEC 61076) - Termination method compatibility (SMT vs through-hole) - Cost vs performance trade-off (e.g., gold vs silver contacts) - Future-proofing (support for next-gen protocols)

8. Industry Trends

Current development directions include: - 1.6Tbps+ optical interfaces using 100G per lane electrical design - EMI reduction through nano-coating and 3D shielding structures - Miniaturization driven by 5G small cells and IoT devices - Integrated magnetics in RJ45 connectors for PoE++ applications - Sustainable materials meeting REACH/RoHS regulations - Smart connectors with embedded diagnostics (IEEE 802.3ap)

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