| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Woodhead - Molex |
CONN MINI SAS RCPT 36POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN SAS RCPT 29POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCPT 50POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN SFP RCPT W/CAGE 2X4 160P RA |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCPT 50POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCPT 26POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCP 68P SLD RA SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCPT 68POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCPT 36POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN NANO-PITCH I/O RCPT 80P SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCPT 68POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN SATA HEADER 7POS SLD PCB |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCP 68P SLD RA SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCP 68P SLD RA SMD |
0 |
|
|
Woodhead - Molex |
CONN ZSFP+ RCPT CAGE 2X4 160P RA |
0 |
|
|
Woodhead - Molex |
CONN MIN 2.0 SAS RCP CAGE 36P RA |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCP 68P SLD RA SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCP 36P SLD RA SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCPT 68POS SLD SMD |
0 |
|
|
Woodhead - Molex |
CONN MINI SAS RCP 26P SLD RA SMD |
0 |
|
Pluggable connectors are modular electronic interfaces enabling rapid connection/disconnection of circuits in high-speed data transmission systems. As critical components in modern communication infrastructure, they support hot-swapping capabilities while maintaining signal integrity. These connectors serve as standardized interfaces between devices, cables, and PCBs, playing essential roles in telecommunications, data centers, and industrial automation.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Fiber Optic Connectors | Supports 10Gbps-400Gbps transmission, LC/MPO interfaces, low insertion loss | Data center backbone networks |
| Copper Cage Connectors | Shielded modular design, supports 1Gbps-100Gbps, thermal management features | Switch/router panel interfaces |
| High-Speed Backplane | Differential pair architecture, impedance-controlled, multi-gigabit per lane | Telecom equipment chassis |
| M12/X-coded Connectors | Industrial Ethernet, IP67 rated, vibration-resistant | Factory automation systems |
Typical pluggable connectors consist of: - Housing: Latch-equipped polymer casing (UL94 V-0 rated) - Contacts: Gold-plated phosphor bronze with 0.1-0.2N contact force - Insulation: High-temperature resistant PBT/GF materials - Termination: Solder tails or press-fit pins (10-40 positions) - Shielding: 360 EMI protection with drain wire connection - Keying: Mechanical polarization to prevent mismatch insertion
| Parameter | Typical Value | Importance |
|---|---|---|
| Contact Resistance | 5-20 m | Directly affects power loss |
| Insulation Resistance | >10^9 | Safety and signal isolation |
| VSWR | <1.5:1 @50GHz | Microwave signal integrity |
| Operating Temp | -55 C to +125 C | Environmental reliability |
| Mating Cycles | 500-1000 cycles | Lifetime durability |
| Manufacturer | Key Products | Specialization |
|---|---|---|
| Amphenol ICC | OptiMux fiber arrays | High-density optical |
| TE Connectivity | MATRIXall backplane | Harsh environment |
| Molex | OSFP800 Series | 800Gbps solutions |
| Samtec | FireFly optical engines | Mid-board optical |
Key considerations: - Signal bandwidth requirements (Nyquist frequency calculation) - Environmental factors (temperature/humidity/chemical exposure) - Compliance with industry standards (IEEE 802.3bs, IEC 61076) - Termination method compatibility (SMT vs through-hole) - Cost vs performance trade-off (e.g., gold vs silver contacts) - Future-proofing (support for next-gen protocols)
Current development directions include: - 1.6Tbps+ optical interfaces using 100G per lane electrical design - EMI reduction through nano-coating and 3D shielding structures - Miniaturization driven by 5G small cells and IoT devices - Integrated magnetics in RJ45 connectors for PoE++ applications - Sustainable materials meeting REACH/RoHS regulations - Smart connectors with embedded diagnostics (IEEE 802.3ap)