Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
ARJC02-111008B

ARJC02-111008B

Abracon

CONN JACK 1PORT 100 BASE-TX PCB

0

ARJ11G-MBSB-MU2

ARJ11G-MBSB-MU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

338

ARJ11D-MASB-B-A-EMU2

ARJ11D-MASB-B-A-EMU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJM11C7-009-NN-EW2

ARJM11C7-009-NN-EW2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

169

ARJ11B-MASAM-MU2

ARJ11B-MASAM-MU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJ-148

ARJ-148

Abracon

CONN JACK 1PORT 1000 BASE-T PCB

661

ARJ11E-MBSC-A-B-EL2

ARJ11E-MBSC-A-B-EL2

Abracon

CONN JACK 1PORT 1000 BASE-TX PCB

0

ARJ11E-MCSB-A-B-GM2

ARJ11E-MCSB-A-B-GM2

Abracon

CONN JACK 1PORT 1000 BASE-TX PCB

0

ARJ11B-MASAZ-LU2

ARJ11B-MASAZ-LU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJ11D-MDSG-B-A-EMU2

ARJ11D-MDSG-B-A-EMU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJ11A-MDSO-MU2

ARJ11A-MDSO-MU2

Abracon

CONN JACK 1PORT 10 BASE-T PCB

0

ARJ11E-MASA-M2

ARJ11E-MASA-M2

Abracon

CONN JACK 1PORT 1000 BASE-TX PCB

0

ARJ11B-MASAS-LU2

ARJ11B-MASAS-LU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJ11B-MESAO-A-A-ELU2

ARJ11B-MESAO-A-A-ELU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJ11B-MBSAO-A-B-ELU2

ARJ11B-MBSAO-A-B-ELU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJ-150B

ARJ-150B

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJE-0040

ARJE-0040

Abracon

CONN JACK 1PORT 1000 BASE-T PCB

0

ARJE-0029

ARJE-0029

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJM11B1-805-AB-EW2

ARJM11B1-805-AB-EW2

Abracon

CONN JACK 1PORT 2.5G BASE-T PCB

0

ARJ11A-MCSI-B-A-EKU2

ARJ11A-MCSI-B-A-EKU2

Abracon

CONN JACK 1PORT 10 BASE-T PCB

0

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

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