Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
JG0-0153NL

JG0-0153NL

PulseLarsen Antenna

CONN JACK

0

J00-0110

J00-0110

PulseLarsen Antenna

CONN JACK

0

JG065Y748NL

JG065Y748NL

PulseLarsen Antenna

CONN JACK

0

J0B-0395

J0B-0395

PulseLarsen Antenna

CONN JACK

0

JC0-1012NL

JC0-1012NL

PulseLarsen Antenna

CONN JACK 2PORT 1000 BASE-T PCB

0

J0B-0222

J0B-0222

PulseLarsen Antenna

CONN JACK

0

J0C-0004T

J0C-0004T

PulseLarsen Antenna

CONN JACK 1PORT 100 BASE-TX SMD

0

J8064D668A

J8064D668A

PulseLarsen Antenna

CONN JACK 6PORT 100 BASE-TX PCB

0

JC0-0255

JC0-0255

PulseLarsen Antenna

CONN JACK

0

JC0-0329

JC0-0329

PulseLarsen Antenna

CONN JACK

0

JP3-0001NL

JP3-0001NL

PulseLarsen Antenna

CONN JACK

0

JC0-1007NL

JC0-1007NL

PulseLarsen Antenna

CONN JACK

0

JK0-0181NL

JK0-0181NL

PulseLarsen Antenna

CONN JACK

0

J0B-0009

J0B-0009

PulseLarsen Antenna

CONN JACK

0

J0C-0005T

J0C-0005T

PulseLarsen Antenna

CONN JACK

0

JG0-0130NL

JG0-0130NL

PulseLarsen Antenna

CONN JACK

0

JG0-0110NL

JG0-0110NL

PulseLarsen Antenna

CONN JACK

0

J10-0025NL

J10-0025NL

PulseLarsen Antenna

CONN JACK

0

JC0-0066

JC0-0066

PulseLarsen Antenna

CONN JACK

0

J0011D21

J0011D21

PulseLarsen Antenna

CONN JACK 1PORT 100 BASE-TX PCB

0

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

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