Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
J2042H3C

J2042H3C

PulseLarsen Antenna

CONN JACK 16PORT 100 BASE-TX PCB

0

JC0-0381NL

JC0-0381NL

PulseLarsen Antenna

CONN JACK

0

J0C-0011NL

J0C-0011NL

PulseLarsen Antenna

CONN JACK

0

J0B-0239

J0B-0239

PulseLarsen Antenna

CONN JACK

0

JC0-0101

JC0-0101

PulseLarsen Antenna

CONN JACK

0

JC0-0359NL

JC0-0359NL

PulseLarsen Antenna

CONN JACK

0

JW0-0008NL

JW0-0008NL

PulseLarsen Antenna

CONN JACK

0

J10-0014NL

J10-0014NL

PulseLarsen Antenna

CONN JACK

0

J30-0008NL

J30-0008NL

PulseLarsen Antenna

CONN JACK

0

JK0D6421

JK0D6421

PulseLarsen Antenna

CONN JACK

0

JK065401

JK065401

PulseLarsen Antenna

CONN JACK

0

JC0-0186NL

JC0-0186NL

PulseLarsen Antenna

CONN JACK

0

J0035D21B

J0035D21B

PulseLarsen Antenna

CONN JACK 1PORT 100 BASE-TX PCB

0

J20-0134NL

J20-0134NL

PulseLarsen Antenna

CONN JACK

0

J20B8T3JNL

J20B8T3JNL

PulseLarsen Antenna

CONN JACK

0

JC0-0291

JC0-0291

PulseLarsen Antenna

CONN JACK

0

J0B-0320

J0B-0320

PulseLarsen Antenna

CONN JACK

0

JK0-0004NL

JK0-0004NL

PulseLarsen Antenna

CONN JACK PULSEJACK 1X1 PORT

0

J3018G21K

J3018G21K

PulseLarsen Antenna

CONN JACK 1PORT 100 BASE-TX SMD

0

JG0-0270NL

JG0-0270NL

PulseLarsen Antenna

CONN JACK

0

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

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