Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
ARJC01-111002T

ARJC01-111002T

Abracon

CONN JACK 1PORT 100 BASE-TX PCB

2521

JXD0-9015NL

JXD0-9015NL

PulseLarsen Antenna

CONN JACK 1PORT 1000 BASE-T PCB

558

ARJ-202B

ARJ-202B

Abracon

CONN JACK 2PORT 1000 BASE-T PCB

2501

0936278020

0936278020

Woodhead - Molex

CONN JACK 1PORT 1000 BASE-T PCB

331

G10X-288S7-QQ

G10X-288S7-QQ

Kycon

CONN JACK 2PORT 1000 BASE-T PCB

56

A836-1A1T-91B

A836-1A1T-91B

Bel Fuse, Inc.

CONN JACK 1PORT 100 BASE-T PCB

499

ARJ11B-MBSBQ-A-B-EMU2

ARJ11B-MBSBQ-A-B-EMU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

7499031120A

7499031120A

Würth Elektronik Midcom

CONN JACK 4PORT 100 BASE-T PCB

0

ARJP11B-MBSB-A-B-EMU2

ARJP11B-MBSB-A-B-EMU2

Abracon

CONN JACK 1PORT 100 BASE-TX PCB

0

7499611421

7499611421

Würth Elektronik Midcom

CONN JACK 1PORT 10G BASE-T PCB

23

7499211123A

7499211123A

Würth Elektronik Midcom

CONN JACK 1PORT 100 BASE-T PCB

0

ARJ11B-MASAP-LU2

ARJ11B-MASAP-LU2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

ARJ14A-MISD-MU2

ARJ14A-MISD-MU2

Abracon

CONN JACK 4PORT 100 BASE-T PCB

0

7499010001A

7499010001A

Würth Elektronik Midcom

CONN JACK 1PORT 100 BASE-T PCB

50

ARJ11E-MBSC-A-B-FL2

ARJ11E-MBSC-A-B-FL2

Abracon

CONN JACK 1PORT 1000 BASE-TX PCB

0

ARJ11G-MASA-A-B-FLT2

ARJ11G-MASA-A-B-FLT2

Abracon

CONN JACK 1PORT 100 BASE-T PCB

0

0826-1X4T-43-F

0826-1X4T-43-F

Bel Fuse, Inc.

CONN JACK 4PORT 1000 BASE-T PCB

295

1368589-5

1368589-5

TRP Connector

CONN JACK 1PORT 1000 BASE-T PCB

1678

JD0-0001NL

JD0-0001NL

PulseLarsen Antenna

CONN JACK 1PORT 1000 BASE-T PCB

0

ARJC01-111002L

ARJC01-111002L

Abracon

CONN JACK 1PORT 100 BASE-TX PCB

4271

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

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