Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
1404281

1404281

Phoenix Contact

CONN MOD JACK 8P8C

0

1403682

1403682

Phoenix Contact

CONN MOD JACK 8P8C 5 POWER

0

1688612

1688612

Phoenix Contact

CONN MOD JACK 8P8C R/A SHIELDED

0

1417274

1417274

Phoenix Contact

RJ45 SOCKET INSERT DEGREE OF PRO

6581

1658833

1658833

Phoenix Contact

CONN MOD JACK 8P8C UNSHIELDED

11

1149867

1149867

Phoenix Contact

RJ45 SOCKET INSERT, DEGREE OF PR

80

1403678

1403678

Phoenix Contact

CONN MOD JACK 8P8C

0

1149854

1149854

Phoenix Contact

RJ45 SOCKET INSERT, DEGREE OF PR

60

1091946

1091946

Phoenix Contact

RJ45 SOCKET INSERT, TYPE: RJ45,

15

1149849

1149849

Phoenix Contact

RJ45 SOCKET INSERT, DEGREE OF PR

32

1403681

1403681

Phoenix Contact

CONN POWER MODULE

0

1420401

1420401

Phoenix Contact

CONN MOD JACK 8P8C R/A SHIELDED

0

1688625

1688625

Phoenix Contact

CONN MOD JACK 8P8C R/A SHIELDED

0

1149871

1149871

Phoenix Contact

RJ45 SOCKET INSERT, DEGREE OF PR

99

1091947

1091947

Phoenix Contact

RJ45 SOCKET INSERT, TYPE: RJ45,

71

1149866

1149866

Phoenix Contact

RJ45 SOCKET INSERT, DEGREE OF PR

73

1149611

1149611

Phoenix Contact

RJ45 JACK INSERT, DEGREE OF PROT

360

1149868

1149868

Phoenix Contact

RJ45 SOCKET INSERT, DEGREE OF PR

76

1099279

1099279

Phoenix Contact

RJ45 SOCKET INSERT, TYPE: RJ45,

75

1688599

1688599

Phoenix Contact

CONN MOD JACK 8P8C R/A SHIELDED

11

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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