Modular Connectors

Modular Connectors - Jacks

Part Number	Description / PDF	Quantity
615008160221 Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A SHIELDED	48
615008150021 Würth Elektronik Midcom	WR-MJ_MODULAR JACKS_MID-MOUNT_TH	323
615016137721 Würth Elektronik Midcom	MODULAR COMM JACK DUAL 8P8C	78
615008160321 Würth Elektronik Midcom	CONN MOD JACK 8P8C VERT UNSHIELD	59
615006144121 Würth Elektronik Midcom	CONN MOD JACK 6P6C VERT UNSHLD	148
615008145221 Würth Elektronik Midcom	CONN MOD JACK 8P8C ANGLED SHLD	2369
615004143821 Würth Elektronik Midcom	CONN MOD JACK 4P4C R/A UNSHLD	2331
634008137521 Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A SHIELDED	0
615008160021 Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A UNSHIELD	99
615008148521 Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A UNSHLD	353
634106149621 Würth Elektronik Midcom	CONN MOD JACK 6P6C VERT SHIELDED	150
615008137121 Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A UNSHLD	280
615032149521 Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A UNSHLD	20
615008140121 Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A SHIELDED	119
615008138321 Würth Elektronik Midcom	CONN MOD JACK 8P8C VERT SHIELDED	1596
615008138221 Würth Elektronik Midcom	CONN MOD JACK 8P8C VERT SHIELDED	2344
615008140621 Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A SHIELDED	2015
615008149521M Würth Elektronik Midcom	CONN MOD JACK 8P8C R/A UNSHLD	108
615008145121 Würth Elektronik Midcom	CONN MOD JACK 8P8C ANGLED SHLD	1191
634108149621 Würth Elektronik Midcom	CONN MOD JACK 8P8C VERT UNSHLD	155

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
RJ11	6-position 2-conductor design, voice-grade transmission	Residential telephone lines
RJ45	8-position 8-conductor, supports up to 10GBASE-T Ethernet	LAN switches/routers
USB Type-A	Rectangular interface with 4-24 pins, supports USB 3.2 Gen2	Computer peripherals
HDMI	19-pin configuration, transmits uncompressed video/audio	Home theaters/monitors
Fiber LC	Duplex optical interface, supports 100Gbps+ transmission	Data center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

Parameter	Typical Values	Importance
Insertion Loss	<0.5dB @100MHz	Signal quality preservation
Durability	750-2000 mating cycles	Long-term reliability
Contact Resistance	10-30m	Power transmission efficiency
Insulation Resistance	>500M	Electrical safety
Operating Temp	-40 C to +85 C	Environmental adaptability

5. Application Fields

Telecom: PBX systems, DSL modems
IT Infrastructure: Server racks, PoE devices
Consumer Electronics: Smart TVs, gaming consoles
Industrial: PLC controllers, SCADA systems
Automotive: Telematics control units

6. Leading Manufacturers and Products

Manufacturer	Key Products
TE Connectivity	Category 8 RJ45 modules
Amphenol	Military-spec circular connectors
Molex	Optical LC duplex adapters
Delphi	Automotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.