Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
GWX-SMT-S-88

GWX-SMT-S-88

Kycon

8P8C SMT SHIELD MOD JACK ROHS CO

0

GWLX-N-88-G/Y-50

GWLX-N-88-G/Y-50

Kycon

8P8C MOD JACK, UNSHIELD, W/GREEN

0

GSGX-NS-5-88-50

GSGX-NS-5-88-50

Kycon

GANGJACK 5PORT RT< 8P8C SHIELD B

0

GMX-SMT2-S2-1010

GMX-SMT2-S2-1010

Kycon

FL/SMT M/JK L/PRF RT<10P10C SHLD

0

GPX-5-62-50

GPX-5-62-50

Kycon

GANGJACK-5PORT-PERPEND-6P2C GREY

0

GAX-7-62-50

GAX-7-62-50

Kycon

GANGJACK 7PORT RT< 6P2C GREY 50U

0

GAX-3-64

GAX-3-64

Kycon

GANGJACK 3PORT RT< 6P4C GREY ROH

0

GSGX-NS-6-88

GSGX-NS-6-88

Kycon

GANGJACK 6PORT RT< 8P8C SHIELD B

0

GLX-N-1010M-50

GLX-N-1010M-50

Kycon

MODJACK LOW/PROF RT< 10P10C GREY

0

GDWLX-PNS-88-Y/G

GDWLX-PNS-88-Y/G

Kycon

8P8C VERT. MOD JACK W/LED, YEL/G

0

GMX-SMT2S2101050TR

GMX-SMT2S2101050TR

Kycon

FL/SMT M/JK L/PR RT<10P10C SHL W

0

GAX-6-62-50

GAX-6-62-50

Kycon

GANGJACK 6PORT RT< 6P2C GREY 50U

0

GMX-SMT4-N-66-50

GMX-SMT4-N-66-50

Kycon

TRUE SMT M/JACK LOW/PROF NO POS

0

GTVX-SMT-N-88-TR

GTVX-SMT-N-88-TR

Kycon

MOD JACK SMT 8P8C TOP ENTRY W/O

0

GSGX-NS2-588-368

GSGX-NS2-588-368

Kycon

G/JK 5PORT RT< 8P8C SHLD LG GT B

0

GSGX-N-8-88-50

GSGX-N-8-88-50

Kycon

GANGJACK 8PORT RT< 8P8C BLACK 50

0

GAX-8-66

GAX-8-66

Kycon

GANGJACK 8PORT RT< 6P6C GREY ROH

0

GSGX-N-2-88-50

GSGX-N-2-88-50

Kycon

GANGJACK 2PORT RT< 8P8C BLACK 50

0

GSX-NS2-88-3.68-50

GSX-NS2-88-3.68-50

Kycon

MODJK RT< 8P8C SHIELD LG GT 3.68

0

GPX-5-62

GPX-5-62

Kycon

GANGJACK-5PORT-PERPEND-6P2C GREY

0

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

RFQ BOM Call Skype Email
Top