Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
GSGX-NS-2-88

GSGX-NS-2-88

Kycon

CONN MOD JACK 8P8C R/A GANG X2

345

GMX-SMT2-N-88-50TR

GMX-SMT2-N-88-50TR

Kycon

FL/SMT M/JACK LW/PROF RT<8P8C BL

0

GLX-A-66

GLX-A-66

Kycon

MODJACK LOW/PROF RT< 6P6C GREY R

1419

GSX-NS7-88-3.05-50

GSX-NS7-88-3.05-50

Kycon

MODJK RT< 8P8C SHIELD TOP AND SI

1070

GPX-2-64

GPX-2-64

Kycon

GANGJACK-2PORT-PERPEND-6P4C GREY

0

GSX-N-88

GSX-N-88

Kycon

MODJACK RT< 8P8C BLACK ROHS COMP

1140

GDLX-A-66

GDLX-A-66

Kycon

MODJK LOW/PROF RT< 6P6C P/STOPS

0

GWX-S9-88-50

GWX-S9-88-50

Kycon

8P8C SHIELD MOD JACK WITH TOP/SI

0

GMX-SMT2N101050TR

GMX-SMT2N101050TR

Kycon

FL/SMT M/JACK LOW/PROF RT<10P10C

0

GMX-SMT2-S7-88-50

GMX-SMT2-S7-88-50

Kycon

FL/SMT M/JK L/PRF RT< 8P8C SNAP

0

GMX-SMT2-N-44

GMX-SMT2-N-44

Kycon

FL/SMT M/JACK LOW/PROF RT<4P4C B

1131

GDCX-PN-44

GDCX-PN-44

Kycon

MODJACK PERPEND 4P4C BLK ROHS CO

700

GMX-S-88-50

GMX-S-88-50

Kycon

MODJK LOW/PROF RT< 8P8C SHIELD B

874

GDTX-S-88-50

GDTX-S-88-50

Kycon

CONN MOD JACK 8P8C VERT SHLD

0

GWLX-S-88-G/Y-50

GWLX-S-88-G/Y-50

Kycon

MODJACK LOW/PROF RT< 8P8C SHIELD

0

GMX-SMT2-N-101050

GMX-SMT2-N-101050

Kycon

FL/SMT M/JK LW/PROF RT<10P10C BL

0

GMJXHT-MM-S-88-50TR

GMJXHT-MM-S-88-50TR

Kycon

8P8C MOD, JACK, MIDMOUNT, SHIELD

0

GDLX-A-64

GDLX-A-64

Kycon

MODJK LOW/PROF RT< 6P4C P/STOPS

0

GDCX-PN-66

GDCX-PN-66

Kycon

MODJACK PERPEND 6P6C BLK ROHS CO

879

GMX-SMT2-S7-8850TR

GMX-SMT2-S7-8850TR

Kycon

FL/SMT M/JK L/PRF RT< 8P8C SNAP

0

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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