Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
TM2RD-F44-4S-220M

TM2RD-F44-4S-220M

Hirose

CONNECTOR

0

TM2RFV-62-4S-74M

TM2RFV-62-4S-74M

Hirose

CONNECTOR

0

TM11R-5L-88(40)

TM11R-5L-88(40)

Hirose

CONN MOD JACK 8P8C R/A SHIELDED

0

TM5RJ3X-44

TM5RJ3X-44

Hirose

CONN MOD JACK 4P4C R/A UNSHLD

0

TM2RGV-L64-5S-500AM

TM2RGV-L64-5S-500AM

Hirose

CONNECTOR

0

TM2RM-E1212-OKSFNP1500

TM2RM-E1212-OKSFNP1500

Hirose

CONNECTOR

0

TM1R-616M44-C-90AK

TM1R-616M44-C-90AK

Hirose

CONNECTOR

0

TM2RD-F44-3S-165M

TM2RD-F44-3S-165M

Hirose

CONNECTOR

0

TM2RM-E1212-A3-45K

TM2RM-E1212-A3-45K

Hirose

CONNECTOR

0

TM1RV-623P66-35S-200UK(30

TM1RV-623P66-35S-200UK(30

Hirose

CONNECTOR

0

TM11R-5M2-88(10)

TM11R-5M2-88(10)

Hirose

CONNECTOR

0

TM5RJ2-66(52)

TM5RJ2-66(52)

Hirose

CONN MOD JACK 6P6C R/A UNSHLD

0

TM10R-64PR6468A(50)

TM10R-64PR6468A(50)

Hirose

CONNECTOR

0

TM1RVX-647AF84-C-680T(30)

TM1RVX-647AF84-C-680T(30)

Hirose

CONN MOD PLUG

0

TM1RV-623KD66-4S-150M

TM1RV-623KD66-4S-150M

Hirose

CONNECTOR

0

TM1RV-623P62-C-140K

TM1RV-623P62-C-140K

Hirose

CONNECTOR

0

TM5RT-1208PWJ

TM5RT-1208PWJ

Hirose

CONN MOD JACK 6P4C R/A UNSHLD

0

TM2REA-1208(56)

TM2REA-1208(56)

Hirose

CONN MOD JACK 6P2C R/A UNSHLD

0

TM1RV-647AF88-35S-250M

TM1RV-647AF88-35S-250M

Hirose

CONNECTOR

0

TM11R-5M2-88-LP(33)

TM11R-5M2-88-LP(33)

Hirose

CONNECTOR

0

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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