Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
35498ZN

35498ZN

Socapex (Amphenol Pcd)

RJFTV SIZE 19 38999 SHELL PLUG K

25

RJFTV2SC1G

RJFTV2SC1G

Socapex (Amphenol Pcd)

RJF TV FIELD THREADED TRANSVERSA

0

RJFTV7SA2G15100BTX

RJFTV7SA2G15100BTX

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHLD

0

RJFTV7PEM2G00

RJFTV7PEM2G00

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHIELDED

0

RJFTVA62SA1N

RJFTVA62SA1N

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C

0

RJ11F22G

RJ11F22G

Socapex (Amphenol Pcd)

CONN MOD JACK 6P6C UNSHIELDED

0

RJF7SA2B10100BTX

RJF7SA2B10100BTX

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHLD

0

RJF2SA5G

RJF2SA5G

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHLD

4

RJFTVA67SA1N

RJFTVA67SA1N

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C

0

RJFTVA67SAPEM1N

RJFTVA67SAPEM1N

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C

0

RJFTV7SA2N15100BTX

RJFTV7SA2N15100BTX

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHLD

0

RJF2SA2B03100BTXSCC

RJF2SA2B03100BTXSCC

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHLD

0

KIT30436

KIT30436

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C SHIELDED

0

36542N

36542N

Socapex (Amphenol Pcd)

RJFTV SIZE 19 38999 SHELL JAM NU

24

RJFTVA67SA1G

RJFTVA67SA1G

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C

0

RJFTV7SA5NF059

RJFTV7SA5NF059

Socapex (Amphenol Pcd)

RJFTV SIZE 19 38999 SHELL JAM NU

1

RJFTV2SA5GF459

RJFTV2SA5GF459

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHLD

0

KIT40792

KIT40792

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C SHIELDED

0

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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