| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Woodhead - Molex |
CONN MOD JACK 8P8C SHIELDED |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A SHIELDED |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A SHIELDED |
1161 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C VERT SHLD |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A SHIELDED |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 6P6C R/A UNSHLD |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A SHIELDED |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A SHIELDED |
0 |
|
|
Woodhead - Molex |
MODULAR JACK WITH LED&INTEGRATED |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 6P2C VERT UNSHLD |
0 |
|
|
Woodhead - Molex |
R/A LOW PROF. SHIELDED PC JACK T |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 6P4C VERT UNSHLD |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A SHIELDED |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P10C R/A SHIELDED |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 6P4C R/A UNSHLD |
0 |
|
|
Woodhead - Molex |
MODJACK RA LOPRO 50AU INV DUAL P |
0 |
|
|
Woodhead - Molex |
SEMCONN SHLD 16CKT |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A SHIELDED |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A UNSHLD |
0 |
|
|
Woodhead - Molex |
CONN MOD JACK 8P8C R/A SHIELDED |
0 |
|
Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| RJ11 | 6-position 2-conductor design, voice-grade transmission | Residential telephone lines |
| RJ45 | 8-position 8-conductor, supports up to 10GBASE-T Ethernet | LAN switches/routers |
| USB Type-A | Rectangular interface with 4-24 pins, supports USB 3.2 Gen2 | Computer peripherals |
| HDMI | 19-pin configuration, transmits uncompressed video/audio | Home theaters/monitors |
| Fiber LC | Duplex optical interface, supports 100Gbps+ transmission | Data center backbone |
Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.
| Parameter | Typical Values | Importance |
|---|---|---|
| Insertion Loss | <0.5dB @100MHz | Signal quality preservation |
| Durability | 750-2000 mating cycles | Long-term reliability |
| Contact Resistance | 10-30m | Power transmission efficiency |
| Insulation Resistance | >500M | Electrical safety |
| Operating Temp | -40 C to +85 C | Environmental adaptability |
| Manufacturer | Key Products |
|---|---|
| TE Connectivity | Category 8 RJ45 modules |
| Amphenol | Military-spec circular connectors |
| Molex | Optical LC duplex adapters |
| Delphi | Automotive-grade sealed jacks |
Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs
Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.