Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
AX100393

AX100393

Belden

PS5 BIX DVO OUTLET,

0

RV5MJKUTB-B24

RV5MJKUTB-B24

Belden

REVCONN CAT5E JACK BLUE TIA

0

AX100394

AX100394

Belden

PS5 BIX DVO OUTLET,

0

AX100798

AX100798

Belden

BIX MODULAR JACK CONN 6-PORT

0

RVAMJKUBR-S1

RVAMJKUBR-S1

Belden

REVCONN 10GX JACK BROWN

0

RV5MJKUTY-B24

RV5MJKUTY-B24

Belden

REVCONN CAT5E JACK YELLOW TIA

0

RVAMJKUTB-B24

RVAMJKUTB-B24

Belden

REVCONN 10GX JACK BLUE TIA

0

RVAMJKUPR-B24

RVAMJKUPR-B24

Belden

REVCONN 10GX JACK PURPLE

38

RV5MJKUTN-S1

RV5MJKUTN-S1

Belden

REVCONN CAT5E JACK BROWN TIA

0

RV5MJKUTB-S1

RV5MJKUTB-S1

Belden

REVCONN CAT5E JACK BLUE TIA

0

RVAMJKUTY-S1

RVAMJKUTY-S1

Belden

REVCONN 10GX JACK YELLOW TIA

0

RV6MJKUBL-B24

RV6MJKUBL-B24

Belden

REVCONN CAT6+ JACK BLUE

0

RV5MJKUTN-B24

RV5MJKUTN-B24

Belden

REVCONN CAT5E JACK BROWN TIA

0

AX100339

AX100339

Belden

PS5 BIX DVO OUTLET,FLUSH

0

RVAMJKURD-B24

RVAMJKURD-B24

Belden

REVCONN 10GX JACK RED

0

RV6MJKUTR-S1

RV6MJKUTR-S1

Belden

REVCONN CAT6+ JACK RED TIA

226

AX100391

AX100391

Belden

PS5 BIX DVO OUTLET,

0

RVAMJKUIV-S1

RVAMJKUIV-S1

Belden

REVCONN 10GX JACK IVORY

0

RV6MJKUYL-B24

RV6MJKUYL-B24

Belden

REVCONN CAT6+ JACK YELLOW

24

RV6MJKUYL-S1

RV6MJKUYL-S1

Belden

REVCONN CAT6+ JACK YELLOW

2959

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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