Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
MTJ-66GX1

MTJ-66GX1

Adam Tech

MODULAR JACK 6P6C

760

MTJ-66WBX1

MTJ-66WBX1

Adam Tech

MODULAR JACK 6P6C

550

MTJ-66WAX1

MTJ-66WAX1

Adam Tech

MODULAR JACK 6P6C

332

MTJ-88AAX1-FSV-PG-LP

MTJ-88AAX1-FSV-PG-LP

Adam Tech

RJ45 MODULAR JACK, SHIELDED, PNL

420

MTJ-64YX1

MTJ-64YX1

Adam Tech

MODULAR JACK 6P4C

580

MTJ-887X1

MTJ-887X1

Adam Tech

MODULAR JACK RJ45 8P8C

120

MTJ-647X1

MTJ-647X1

Adam Tech

MODULAR JACK 6P4C

670

MTJ-88TX1-FSD-L16

MTJ-88TX1-FSD-L16

Adam Tech

RJ45 MODULAR JACK, SHIELDED, DIP

156

MTJ-44HX1

MTJ-44HX1

Adam Tech

MODULAR JACK 4P4C

96

MTJ-889X1-FSE

MTJ-889X1-FSE

Adam Tech

MODULAR JACK RJ45 8P8C

0

MTJ-88TX1-FSD-LH

MTJ-88TX1-FSD-LH

Adam Tech

RJ45 MODULAR JACK, SHIELDED, DIP

143

MTJ-880X1

MTJ-880X1

Adam Tech

MODULAR JACK RJ45 8P8C

1019

MTJ-88TX1-FSD-LP

MTJ-88TX1-FSD-LP

Adam Tech

RJ45 MODULAR JACK, SHIELDED, DIP

156

MTJ-88ARX1-FSM-LH

MTJ-88ARX1-FSM-LH

Adam Tech

RJ45 MODULAR JACK, SHIELDED, DIP

31

MTJ-88TX1-FSD-LG

MTJ-88TX1-FSD-LG

Adam Tech

RJ45 MODULAR JACK, SHIELDED, DIP

258

MTJ-663X1

MTJ-663X1

Adam Tech

CONN MOD JACK 6P6C VERT UNSHIELD

1792

MTJ-88ARX1-LH

MTJ-88ARX1-LH

Adam Tech

RJ45 MODULAR JACK, DIP, SIDE ENT

555

MTJ-88TX1-FSD-PG-LD

MTJ-88TX1-FSD-PG-LD

Adam Tech

RJ45 MODULAR JACK, SHIELDED, DIP

59

MTJ-88DX1-LP

MTJ-88DX1-LP

Adam Tech

RJ45 MODULAR JACK, DIP, TOP ENTR

260

MTJ-88TX1-LV

MTJ-88TX1-LV

Adam Tech

RJ45 MODULAR JACK, DIP, SIDE ENT

226

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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