Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
RJSSE-5080-02

RJSSE-5080-02

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

2146

6368011-4

6368011-4

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

454

6116353-2

6116353-2

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

0

MRJ5C8001

MRJ5C8001

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

101

RJHSE5180

RJHSE5180

Storage & Server IO (Amphenol ICC)

8P8C, RA, SHIELD WITH TOP AND SI

1440

1-406507-4

1-406507-4

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

3564

SS-748802SC5-YG-PG4-BZ

SS-748802SC5-YG-PG4-BZ

Stewart Connector

CONN MOD JACK 8P8C R/A SHIELDED

354

8949-D88/30SB0BA

8949-D88/30SB0BA

Oupiin

RJ45 CONNECTOR, 8 POSITION, 8 CO

2000

1404278

1404278

Phoenix Contact

CONN MOD JACK 8P8C

0

GDLX-N-64

GDLX-N-64

Kycon

MODJACK LOW/PROF RT< 6P4C BLACK

0

SS-641010-NF-50

SS-641010-NF-50

Stewart Connector

CONN MOD JACK 10P10C R/A UNSHLD

0

1705549-1

1705549-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C SHLD

1567

09145451562

09145451562

HARTING

HAN-MOD IDC CAT6A RJ45 CABLE JAC

8

SS63600-005F

SS63600-005F

Stewart Connector

CONN MOD JACK 6P6C R/A UNSHLD

1714

GSX-NS7-88-3.68-50

GSX-NS7-88-3.68-50

Kycon

MODJK RT< 8P8C SHIELD TOP AND SI

0

GMX-N-66

GMX-N-66

Kycon

CONN MOD JACK 6P6C R/A UNSHLD

7941

615004143821

615004143821

Würth Elektronik Midcom

CONN MOD JACK 4P4C R/A UNSHLD

2331

5406552-1

5406552-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

563

TM11R-3C-88(50)

TM11R-3C-88(50)

Hirose

CONN MOD JACK 8P8C VERT SHIELDED

383

TM5RC-66(50)

TM5RC-66(50)

Hirose

CONN MOD JACK 6P6C R/A UNSHLD

1465

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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