Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
MTJ-88ARX1-FSM-PG-LP

MTJ-88ARX1-FSM-PG-LP

Adam Tech

RJ45 MODULAR JACK, SHIELDED, PNL

236

GWX-S9-88

GWX-S9-88

Kycon

8P8C SHIELD MOD JACK WITH TOP/SI

530

2170129-1

2170129-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

1230

TM5RE3-64(20)

TM5RE3-64(20)

Hirose

CONN MOD JACK 6P4C R/A UNSHLD

0

615008140421

615008140421

Würth Elektronik Midcom

CONN MOD JACK 8P8C VERT SHIELDED

2369

IAEBH6

IAEBH6

Panduit Corporation

CATEGORY 6, RJ45, 8-POSITION, 8-

7100

RJHSE538504

RJHSE538504

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

416

1888653-3

1888653-3

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

399

5406217-1

5406217-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

1636

GMJXHT-MM-S-88-TR

GMJXHT-MM-S-88-TR

Kycon

8P8C MOD JACK, MIDMOUNT, SHIELDE

0

GMX-SMT2-S7-88

GMX-SMT2-S7-88

Kycon

FL/SMT M/JK L/PRF RT< 8P8C SNAP

80

MRJ5A8001

MRJ5A8001

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

0

RV5IJ2UBK-S1

RV5IJ2UBK-S1

Belden

JACK CAT 5E UTP RJ45 BLK

9262

RJSAE508002

RJSAE508002

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

0

1-1775855-1

1-1775855-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

238

1-1909119-4

1-1909119-4

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

2749

5557969-2

5557969-2

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C VERT SHIELDED

2425

GMX-SMT2-S2-88

GMX-SMT2-S2-88

Kycon

FL/SMT M/JK L/PRF RT< 8P8C SHLD

805

TM3RA1-44(67)

TM3RA1-44(67)

Hirose

CONN MOD JACK 4P4C VERT UNSHLD

0

GMX-SMT2-S-66

GMX-SMT2-S-66

Kycon

FL/SMT M/JK L/PROF RT< 6P6C SHIE

1220

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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