Modular Connectors

Modular Connectors - Adapters

Part Number	Description / PDF	Quantity
0847000001 Woodhead - Molex	CONN MOD COUPLER 8P8C TO 8P8C	278
1300550016 Woodhead - Molex	CONN MOD ADAPTER 8P8C TO PCB	0
1300580057 Woodhead - Molex	CONN MOD COUPLER 8P8C TO 8P8C	3
1300550014 Woodhead - Molex	ENET FR/FR PASS-THRU RJ11 SHLD	6
1300550001 Woodhead - Molex	CONN MOD COUPLER 8P8C TO 8P8C	188
1300580059 Woodhead - Molex	CONN MOD COUPLER 8P8C TO 8P8C	0
0936060017 Woodhead - Molex	DATA INTERFACE : 2XRJ45 F-F	0
0936014829 Woodhead - Molex	COUP RJ/RJ SOCK MET. HE HSG BLK	0
0936014791 Woodhead - Molex	COUP RJ/RJ SOCKET INSULDING HSG	0
0936060144 Woodhead - Molex	RJ45 SOCKET/SOCKET 8P8C PIN TO P	0
0936014727 Woodhead - Molex	COUP RJ/RJ SOCKET INSULDING HSG	0
0936014769 Woodhead - Molex	COUP RJ/RJ SOCK MET. HE HSG BLK	0
0936014729 Woodhead - Molex	COUP RJ/RJ SOCKET METAL HE HSG B	0
0936014767 Woodhead - Molex	COUP RJ/RJ SOCK INSUL HSG BLK,8P	0
0936014826 Woodhead - Molex	COUP RJ/RJ SOCK INSU HSG GRY,8P8	0
0936014726 Woodhead - Molex	COUP RJ/RJ SOCKET INSULDING HSG	0
0936060137 Woodhead - Molex	RJ45 SOCKET/SOCKET 8P4C CROSSOVE	0
0936060141 Woodhead - Molex	RJ45 SOCKET/SOCKET 8P4C + 2P CRO	0
0936014827 Woodhead - Molex	COUP RJ/RJ SOCK INSU HSG BLK,8P8	0
0936014792 Woodhead - Molex	COUP RJ/RJ SOCKET METAL STD HSG	0

Modular Connectors - Adapters

1. Overview

Modular connectors and adapters are standardized electro-mechanical interfaces enabling rapid connection/disconnection of electronic devices. These components ensure interoperability across systems through defined physical layouts, contact arrangements, and signal protocols. Their hot-swappable design supports system scalability, maintenance efficiency, and cross-platform compatibility in telecommunications, computing, and industrial applications.

2. Main Types & Functional Classification

Type	Key Features	Applications
RJ Series (RJ11/RJ45)	Click-lock plastic housing, 4-8 contacts, CAT5+ compliance	Telecom landlines, Ethernet networks
USB Adapters	Type-A/B/C variants, reversible design, up to 40Gbps support	Peripheral connectivity, mobile charging
DIN/Mini-DIN	Circular metal contacts, EMI shielding, 3-9 pins	Audio equipment, industrial sensors
Fiber Optic Adapters	LC/SC/MPO interfaces, <0.2dB insertion loss	Data centers, high-speed backbone networks

3. Structural Composition

Typical modular connectors integrate:

Mechanical Structure: Thermoplastic housing with precise contact alignment
Electrical Contacts: Phosphor bronze conductors with gold-plated surfaces (30-50 in)
Locking Mechanism: Spring-loaded latches or threaded couplings
Shielding Layer: EMI protection via metal cans or conductive coatings
Strain Relief: Cable anchoring system to prevent mechanical stress

4. Key Technical Parameters

Parameter	Typical Range	Critical Impact
Current Rating	1-10A	Power transmission capability
Contact Resistance	<10m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-2kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-10,000 cycles	Durability indicator

5. Application Fields

Telecommunications: Network switches, VoIP systems
Consumer Electronics: Smartphones, laptops
Industrial Automation: PLC interfaces, sensor arrays
Medical Equipment: Patient monitoring systems, diagnostic devices
Transportation: In-vehicle infotainment, avionics

6. Leading Manufacturers & Products

Vendor	Country	Signature Products
TE Connectivity	USA	Category 8 RJ45 modules
Amphenol	USA	MIL-DTL-38999 circular connectors
Molex	USA	Mini50 high-speed backplane connectors
L-com	USA	OM4 multimode fiber adapters

7. Selection Guidelines

Key evaluation criteria:

Signal Type: Power (voltage/current requirements) vs. data (frequency up to 40GHz)
Environmental Conditions: Temperature extremes, vibration exposure
Compliance Standards: RoHS, REACH, UL certification
Space Constraints: Board footprint and height limitations
Cost Optimization: Balance between gold-plating thickness and lifecycle costs

Example: Selecting USB-C with 40Gbps support for AR/VR headsets requiring high-bandwidth video transmission.

8. Industry Trends

Emerging directions include:

Miniaturization: 0.4mm pitch connectors for IoT devices
High-Speed Evolution: 112Gbps backplane connectors for 5G infrastructure
Smart Integration: Connectors with built-in current/voltage monitoring
Sustainability: Bio-based polymers reducing carbon footprint
Modular Hybrids: Combined power/data interfaces for industrial IoT gateways