Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
ST1W008S4ER1500

ST1W008S4ER1500

JAE Electronics

CONN MICRO SD CARD HINGED TYPE

16734

SF7W006S1AR1000

SF7W006S1AR1000

JAE Electronics

CONN SIM/SAM CARD HINGED TYPE

5216

SF7W006S4ER1500

SF7W006S4ER1500

JAE Electronics

CONN SIM CARD HINGED TYPE R/A

21421

SF72S006VBDR2500

SF72S006VBDR2500

JAE Electronics

NANO SIM CARD CONNECTOR

7973

JC26E-DRRE

JC26E-DRRE

JAE Electronics

CONN COMPACT FLASH CARD SNAP-IN

0

JC26C2-FSR16E

JC26C2-FSR16E

JAE Electronics

CONN COMPACT FLASH CARD SNAP-IN

154

JC26C2-DSR16E

JC26C2-DSR16E

JAE Electronics

CONN COMPACT FLASH CARD SNAP-IN

0

ST12S010VBAR1800

ST12S010VBAR1800

JAE Electronics

PUSH-PUSH TYPE MICROSD MEMORY CA

1740

JC26C2-FRR16E

JC26C2-FRR16E

JAE Electronics

CONN COMPACT FLASH CARD SNAP-IN

0

SF9-STS1-A

SF9-STS1-A

JAE Electronics

CONN SIM CARD PUSH-PULL SNAP-IN

1752

SF53S006VCBR2000

SF53S006VCBR2000

JAE Electronics

PUSH-PULL MICRO SIM CARD CONNECT

2635

JC26C2-DSRE

JC26C2-DSRE

JAE Electronics

CONN COMPACT FLASH CARD SNAP-IN

37

JC26C2-FRM16E

JC26C2-FRM16E

JAE Electronics

CONN COMPACT FLASH CARD SNAP-IN

0

JC26E-DSRE

JC26E-DSRE

JAE Electronics

CONN COMPACT FLASH CARD SNAP-IN

368

ST11S008V4HR2000

ST11S008V4HR2000

JAE Electronics

CONN MICRO SD CARD PUSH-PUSH R/A

16389

JC26A-BB16E

JC26A-BB16E

JAE Electronics

CONN COMPACT FLASH CARD R/A SMD

26

SF72S006VBAR2500

SF72S006VBAR2500

JAE Electronics

CONN NANO SIM CARD PUSH-PUSH

0

JC26E-BBE

JC26E-BBE

JAE Electronics

CONN COMPACT FLASH CARD R/A SMD

0

SF70S006VBAR2000

SF70S006VBAR2000

JAE Electronics

CONN NANOSIM CARD PUSH EJECT

1905

SF78S012VBAR1400

SF78S012VBAR1400

JAE Electronics

DUAL NANO SIM CARD CONNECTOR

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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