Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
CCM01-2251

CCM01-2251

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM03-3012

CCM03-3012

C&K

CONN SIM/SAM CARD HINGED TYPE

0

CCM04-1317LFT R701

CCM04-1317LFT R701

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM02-F503LFT T30

CCM02-F503LFT T30

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM03-3504

CCM03-3504

C&K

CONN SIM/SAM CARD PUSH-PULL R/A

0

CCM04-1316LFT R701

CCM04-1316LFT R701

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM02-1NO-32

CCM02-1NO-32

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM03-3517LFT R132

CCM03-3517LFT R132

C&K

CONN SIM/SAM CARD HINGED TYPE

0

CCM04-1316

CCM04-1316

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM02-1NO-35

CCM02-1NO-35

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM03-3517

CCM03-3517

C&K

CONN SIM/SAM CARD HINGED TYPE

0

CCM02-2508

CCM02-2508

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM01-2013LFT T30

CCM01-2013LFT T30

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM04-1317

CCM04-1317

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM05-5773LFT T50

CCM05-5773LFT T50

C&K

CONN MINI SD CARD PUSH-PULL R/A

0

CCM02-2504

CCM02-2504

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM03-3758

CCM03-3758

C&K

CONN SIM/SAM CARD PUSH-PULL R/A

0

CCM01-2251LFT T30

CCM01-2251LFT T30

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM01-2013AP LFT T30

CCM01-2013AP LFT T30

C&K

CONN SMART CARD PUSH-PULL R/A

0

CCM01-6201

CCM01-6201

C&K

CONN SMART CARD PUSH-PULL R/A

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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