Memory Connectors - Inline Module Sockets

Part Number	Description / PDF	Quantity
0787261004 Woodhead - Molex	CONN SKT DIMM 288POS PCB	0
0879160111 Woodhead - Molex	CONN SKT DIMM 240POS PCB	102
0879180001 Woodhead - Molex	CONN SKT MINIDIMM 244POS R/A SMD	124
0878030012 Woodhead - Molex	CONN SKT DIMM 240POS PCB	58
0877830301 Woodhead - Molex	CONN SKT MINIDIMM 244POS SMD	606
0878030112 Woodhead - Molex	CONN SKT DIMM 240POS PCB	319
0787311002 Woodhead - Molex	CONN SKT DIMM 288POS PCB	338
1511050002 Woodhead - Molex	DDR4 MINI DIMM VT SMT .76AULF 28	1158
0787261002 Woodhead - Molex	CONN SKT DIMM 288POS PCB	479
0780011344 Woodhead - Molex	CONN SKT MINIDIMM 244POS R/A SMD	0
0787261005 Woodhead - Molex	CONN SKT DIMM 288POS PCB	0
0787261003 Woodhead - Molex	CONN SKT DIMM 288POS PCB	0
0787301002 Woodhead - Molex	CONN SKT DIMM 288POS SMD	3839
1511050003 Woodhead - Molex	CONN SKT MINIDIMM 288POS PCB	182
0780350001 Woodhead - Molex	CONN SKT MINIDIMM 244POS SMD REV	480
0781560001 Woodhead - Molex	CONN SKT DIMM 240POS SMD	118
0877822001 Woodhead - Molex	CONN SKT MINIDIMM 244POS SMD	351
1511340001 Woodhead - Molex	DDR4 22.5DEG MINIDIMM ASSY SMT 2	0
0877051051 Woodhead - Molex	CONN SKT DIMM 240POS PCB	5
0879180301 Woodhead - Molex	CONN SKT MINIDIMM 244POS R/A SMD	434

Memory Connectors - Inline Module Sockets

1. Overview

Inline Module Sockets are electro-mechanical interfaces designed to connect memory modules (e.g., DRAM, SRAM) to printed circuit boards (PCBs). These connectors ensure reliable electrical conductivity, mechanical stability, and signal integrity in high-speed data transmission environments. They play a critical role in computing systems, telecommunications infrastructure, and industrial equipment by enabling modular memory upgrades and maintenance.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
DIMM Socket	64-bit data path, 240/288 pins, ZIF technology	Desktop/server RAM modules
SO-DIMM Socket	Smaller form factor, 200/260 pins, low insertion force	Laptops, embedded systems
UDIMM Socket	Unbuffered design, direct memory controller connection	Consumer PCs, workstations
RDIMM Socket	Registered buffering for improved signal stability	Enterprise servers, data centers

3. Structure and Composition

Typical components include:

Contact points: Phosphor bronze or beryllium copper with gold plating
Insulation housing: High-temperature resistant thermoplastics (LCP, PBT)
Actuator mechanism: Z-axis compression system for secure module retention
PCB termination: Through-hole or surface-mount solder tails

Advanced designs incorporate impedance-matched contacts and anti-vibration locking features.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Contact Resistance	10m	Ensures minimal signal loss
Current Rating	1-3A per pin	Determines power delivery capability
Operating Temperature	-55 C to +125 C	Guarantees performance in extreme conditions
Insertion Life	1000+ cycles	Affects product longevity

5. Application Fields

Computer hardware: Motherboards, GPU memory interfaces
Telecommunications: 5G base stations, network switches
Industrial automation: PLC controllers, vision systems
Medical equipment: Imaging devices, patient monitors

6. Leading Manufacturers and Products

Manufacturer	Product Series	Special Features
TE Connectivity	MAX Density DIMM	36% higher pin density
Amphenol ICC	Verge X1	12Gbps data rate support
Molex	DDR5 UDIMM	Integrated error detection

7. Selection Recommendations

Key considerations:

Memory standard compatibility (DDR4/DDR5, RDIMM/UDIMM)
Vibration resistance for industrial applications
Thermal management requirements
Compliance with JEDEC standards

Case study: Data centers prioritizing RDIMM sockets with ECC support for mission-critical servers.

8. Industry Trends

Emerging developments include:

Migration to DDR5 interfaces with 6400MT/s+ speeds
Miniaturization for mobile device integration
Smart sockets with integrated diagnostic capabilities
Eco-friendly materials meeting RoHS/REACH regulations

Market forecasts predict 8.2% CAGR through 2030 driven by AI and 5G infrastructure demands.