Keystone - Inserts

Part Number	Description / PDF	Quantity
1689064 Phoenix Contact	INSERT RJ45 JACK COUPLER	326211
1656356 Phoenix Contact	INSERT 6P6C JACK COUPLER	0
1086108 Phoenix Contact	INSERT RJ45 JACK COUPLER	107111
1657766 Phoenix Contact	INSERT RJ45 JACK DUAL COUPLER	2
1653168 Phoenix Contact	INSERT RJ45 JACK TO IDC CONN	2
1654552 Phoenix Contact	INSERT RJ45 JACK COUPLER	0
1404506 Phoenix Contact	FRONT PLATE WITH CONTACT INSERTS	0
1404512 Phoenix Contact	SI-FP-R1A-U1A/0 7	0
1404497 Phoenix Contact	SI-FP-R1A-U1A-D1A	0
1404496 Phoenix Contact	SI-FP-R1A-D1A	0
1657708 Phoenix Contact	INSERT DB9 RCPT TO DB9 PLUG	0
1404499 Phoenix Contact	INSERT RJ45 8P8C USB A	0
1419021 Phoenix Contact	RJ45 SKT INSERT DEGREE OF PROTEC	0
1404500 Phoenix Contact	SI-FP-R1A-D1E	0
1652402 Phoenix Contact	INSERT RJ45 JACK TO IDC CONN	18
1653155 Phoenix Contact	INSERT RJ45 JACK COUPLER	0
1689077 Phoenix Contact	INSERT RJ45 JACK TO IDC CONN	0
1689459 Phoenix Contact	INSERT RJ45 JACK COUPLER	0
1404502 Phoenix Contact	SI-FP-R1A-D1B-D3B	0
1657737 Phoenix Contact	INSERT DB15 RCPT TO DB15 PLUG	0

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
RJ45 Ethernet	8P8C configuration, supports 10/100/1000BASE-T networks	Network switches, PoE devices
RJ11/12	6P4C/6P6C configurations, voice/data transmission	Telephony systems, fax machines
Fiber Optic	LC/SC/MPO interfaces, single/multi-mode support	Data centers, backbone networks
Coaxial	75 /50 impedance, RF signal transmission	CCTV systems, satellite receivers
Composite	Multi-protocol integration (HDMI/USB/Power over Ethernet)	AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

Parameter	Value Range	Importance
Insertion Loss	0.5dB @100MHz	Signal integrity maintenance
Contact Resistance	10-30m (initial)	Power transmission efficiency
Withstand Voltage	1000VAC rms	Electrical safety compliance
Mating Cycles	750-1500 cycles	Service life prediction
Operating Temperature	-40 C to +85 C	Environmental adaptability

5. Application Fields

Telecommunications: Central office switching systems, DSLAM cabinets
Data Centers: 1U patch panels, high-density fiber distribution
Security Systems: IP camera connectivity, access control panels
Industrial Automation: PROFINET/Industrial Ethernet nodes
Residential: Smart home gateway integration

6. Leading Manufacturers and Products

Manufacturer	Product Line	Key Features
TE Connectivity	DEUTSCH DT Series	IP68-rated, automotive-grade durability
Amphenol	OptiCore OCX	100Gbps fiber optic transmission
Molex	Gigabit Ethernet	Shielded Cat6A compliance
Bel Stewart	Power over Ethernet	100W (IEEE 802.3bt) support
Panduit	NetKey HDX	28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)