Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX102598

AX102598

Belden

MDVO BNC COAXIAL MODULE,

0

AX105336-EW

AX105336-EW

Belden

KCONN S-VIDEO F/F COUPER, EW

0

AX100653

AX100653

Belden

EZ-MDVO UTP MODULE, CAT5E,

0

AX101072

AX101072

Belden

CAT6+ JACK MDVO PURPLE TIA 606

0

AX103015

AX103015

Belden

MDVO LC KEY DUP MM WH-GR

0

AX104188-B24

AX104188-B24

Belden

CAT5E JACK KCONN BROWN

0

AX104624-03

AX104624-03

Belden

MDVO SC SM MODULE, WHITE

0

AX102288

AX102288

Belden

10GX JACK KCONN BLUE TIA606

4129

AX101070

AX101070

Belden

CAT6+ JACK MDVO GREEN TIA606

0

AX105336-AL

AX105336-AL

Belden

KCONN S-VIDEO F/F COUPER, AL

0

AX101319-B24

AX101319-B24

Belden

CAT6+ JACK KCONN ALMOND

0

AX105340-BK

AX105340-BK

Belden

KCONN RCA-GN COUPLER, BLK

0

HIP-4H

HIP-4H

Belden

HIP-4 SPLITTER, 4 WAY,HORIZ

0

AX105698-BK

AX105698-BK

Belden

MDVO SC APC MODULE, BLACK

0

AX101309

AX101309

Belden

CAT5E JACK KCONN ELEC WHITE

64

AX102280

AX102280

Belden

10GX JACK KCONN GRAY

1612

AX102578

AX102578

Belden

MEDIAFLEX RCA IDC INSERT

0

A0406997

A0406997

Belden

MDVO BNC COAXIAL MODULE,

88

AX105346-AL

AX105346-AL

Belden

KCONN F-COAX 3GHZ, ALM

0

AX102212

AX102212

Belden

MDVO LC DUP MM MOD BLACK

0

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

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