Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
N235-001-WH

N235-001-WH

Tripp Lite

INSERT RJ45 JACK COUPLER

2822800

N238-001-WH

N238-001-WH

Tripp Lite

INSERT RJ45 JACK TO IDC CONN

7388150

N238-001-BL

N238-001-BL

Tripp Lite

INSERT RJ45 JACK TO IDC CONN

898650

A008-000-KJ

A008-000-KJ

Tripp Lite

INSERT RCA JACK COUPLER

89660

N235-001

N235-001

Tripp Lite

INSERT RJ45 JACK COUPLER

45539850

U325-000-KP-BK

U325-000-KP-BK

Tripp Lite

USB 3.0 ALL-IN-ONE KEYSTONE/PANE

2500

U060-000-KPA-BK

U060-000-KPA-BK

Tripp Lite

USB 2.0 ALL-IN-ONE KEYSTONE/PANE

40520

N455-000-BL-KJ

N455-000-BL-KJ

Tripp Lite

DUPLEX MULTIMODE FIBER COUPLER,

12640

U325-000-KPA-BK

U325-000-KPA-BK

Tripp Lite

USB 3.0 ALL-IN-ONE KEYSTONE/PANE

43600

U060-000-KP-WH

U060-000-KP-WH

Tripp Lite

USB 2.0 PANEL MOUNT COUPLER KEYS

42550

N238-001-SH-TFA

N238-001-SH-TFA

Tripp Lite

INSERT RJ45 JACK - IDC CONNECTOR

1019

N235-001-6A

N235-001-6A

Tripp Lite

INSERT RJ45 JACK TO RJ45 JACK

169633

N238-001-GY-TFA

N238-001-GY-TFA

Tripp Lite

INSERT RJ45 JACK - IDC CONNECTOR

700

N206-KJ01-IND

N206-KJ01-IND

Tripp Lite

KEYSTONE JACK CAT6/CAT5E, RJ45,

3290

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

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