| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
HellermannTyton |
INSERT RJ45 JACK TO IDC CONN |
0 |
|
 |
Panduit Corporation |
MINI-COM MODULE, CAT6A, 28/30 AW |
220 |
|
 |
Panduit Corporation |
CAT6A SPRING SHUTTERED JACK, TG |
0 |
|
 |
Panduit Corporation |
CAT 5E SPRING SHUTTERED JACK, TG |
150 |
|
 |
Panduit Corporation |
MODULE JACK |
5911700 |
|
 |
Panduit Corporation |
MODULE JACK |
201770 |
|
 |
HellermannTyton |
INSERT RJ45 JACK TO IDC 50/BX |
0 |
|
 |
Tripp Lite |
USB 3.0 ALL-IN-ONE KEYSTONE/PANE |
2500 |
|
 |
Panduit Corporation |
MINI-COM MODULE, CAT 6, UTP, 8 P |
75 |
|
 |
Panduit Corporation |
MINI-COM MODULE, CAT 6, SHIELDED |
241176 |
|
 |
Panduit Corporation |
NK FIBER OPTIC ADAPTER MODULE |
0 |
|
 |
Panduit Corporation |
STAINLESS STEEL WALL PHONE PLATE |
122360 |
|
 |
Panduit Corporation |
CATEGORY 6A, RJ45, 10 GB/S, 8-PO |
36 |
|
 |
Telegärtner |
AMJ-S MODULE 2G CAT.6A T568A |
0 |
|
 |
Panduit Corporation |
CATEGORY 5E, RJ45, 8-POSITION, 8 |
5011150 |
|
 |
Panduit Corporation |
CATEGORY 5E, RJ45, 8-POSITION, 8 |
21012050 |
|
 |
Quest Technology International |
LOCJACK SECURITY KEYSTONE JACK |
240 |
|
 |
Panduit Corporation |
MINI-COM MODULE, CAT 6A, UTP, 8 |
48 |
|
 |
Panduit Corporation |
MINI-COM COUPLER MODULE, CAT 6A, |
0 |
|
 |
DataComm Electronics, Inc. |
CAT 5E DATA JACK, BLUE, 10 PACK |
400 |
|
Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| RJ45 Ethernet | 8P8C configuration, supports 10/100/1000BASE-T networks | Network switches, PoE devices |
| RJ11/12 | 6P4C/6P6C configurations, voice/data transmission | Telephony systems, fax machines |
| Fiber Optic | LC/SC/MPO interfaces, single/multi-mode support | Data centers, backbone networks |
| Coaxial | 75 /50 impedance, RF signal transmission | CCTV systems, satellite receivers |
| Composite | Multi-protocol integration (HDMI/USB/Power over Ethernet) | AV distribution systems |
Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.
| Parameter | Value Range | Importance |
|---|---|---|
| Insertion Loss | 0.5dB @100MHz | Signal integrity maintenance |
| Contact Resistance | 10-30m (initial) | Power transmission efficiency |
| Withstand Voltage | 1000VAC rms | Electrical safety compliance |
| Mating Cycles | 750-1500 cycles | Service life prediction |
| Operating Temperature | -40 C to +85 C | Environmental adaptability |
| Manufacturer | Product Line | Key Features |
|---|---|---|
| TE Connectivity | DEUTSCH DT Series | IP68-rated, automotive-grade durability |
| Amphenol | OptiCore OCX | 100Gbps fiber optic transmission |
| Molex | Gigabit Ethernet | Shielded Cat6A compliance |
| Bel Stewart | Power over Ethernet | 100W (IEEE 802.3bt) support |
| Panduit | NetKey HDX | 28% smaller footprint than standard |
Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.
Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)