Fiber Optic Connectors - Adapters

Image Part Number Description / PDF Quantity Rfq
T13AF

T13AF

Paladin Tools (Greenlee Communications)

CONN ADAPT RCPT SOC-MTRJ SIMPLEX

0

AE2-10

AE2-10

Paladin Tools (Greenlee Communications)

CONN ADAPT RCPT UCI-E2000 SMPLX

0

T1081

T1081

Paladin Tools (Greenlee Communications)

CONN ADAPT RCPT SOC-VFO SIMPLEX

0

T13A2

T13A2

Paladin Tools (Greenlee Communications)

CONN ADAPT RCPT SOC-MTRJ SIMPLEX

0

APC-108

APC-108

Paladin Tools (Greenlee Communications)

CONN ADAPTER RCPT UCI-FC SIMPLEX

0

T1047

T1047

Paladin Tools (Greenlee Communications)

CONN ADAPT RCPT SOC-BNC SIMPLEX

0

T1040

T1040

Paladin Tools (Greenlee Communications)

CONN ADAPT RCPT SOC-HMS SIMPLEX

0

AD-108

AD-108

Paladin Tools (Greenlee Communications)

CONN ADAPT RCPT UCI-DIN SIMPLEX

0

Fiber Optic Connectors - Adapters

Fiber optic connectors and adapters are critical components in optical fiber communication systems, enabling secure and precise interconnection between fiber optic cables, devices, and networks. These adapters maintain signal integrity by aligning fiber cores accurately and minimizing optical loss. Their importance has grown exponentially with the expansion of high-speed data transmission in telecommunications, data centers, and 5G infrastructure.

TypeFunctional FeaturesApplication Examples
LC (Lucent Connector)Small form factor, push-pull design, low insertion lossDatacom/telecom transceivers, SFP modules
SC (Subscriber Connector)Push-pull mechanism, durable ceramic ferruleFTTH networks, EPON systems
ST (Straight Tip)Bayonet-style locking, robust mechanical designIndustrial networks, military applications
FC (Ferrule Connector)Screw-on coupling, high vibration resistanceTest equipment, single-mode systems
MPO/MTPMulti-fiber array, high-density parallel optics40/100G Ethernet, data center backbones

Typical physical structure includes:

  • Outer housing (thermoplastic or metal for durability)
  • Ceramic or polymer ferrule for precise fiber alignment
  • Spring-loaded mechanism for consistent mating pressure
  • Keying features to ensure correct orientation
  • Optical interfaces with ultra-smooth PC/APC polishing

Technical composition involves precision machining ( 0.5 m tolerance), anti-reflective coatings, and materials meeting Telcordia GR-326-CORE standards.

ParameterSignificance
Insertion Loss ( 0.2dB)Measures optical power loss during signal transmission
Return Loss ( 50dB)Indicates reflection suppression capability
Operating Temperature (-40 C to +85 C)Environmental stability range
Interchangeability ( 0.1dB variation)Consistency across multiple mating cycles
Endface Geometry (Radius: 10-15mm)Determines physical contact quality

Primary industries include:

  • Telecommunications (OLT/ONU equipment, long-haul networks)
  • Data Centers (switch interconnects, backbone cabling)
  • Medical Imaging (endoscopy, laser surgery systems)
  • Industrial Sensing (temperature/strain monitoring)
  • 5G Infrastructure (radio access network fronthaul/backhaul)

Typical equipment: DWDM multiplexers, OXCs, FTTx ONUs, and test & measurement devices.

ManufacturerRepresentative Products
CommScopeLC Multi-fiber Adapter Panels
TE ConnectivityMT-RJ Hybrid Adapters
FujikuraHigh-Density MPO Cassette Systems
Senko Advanced ComponentsSC APC Singlemode Adapters
Amphenol Fiber SolutionsExpanded Beam Military-Grade Adapters
  • Determine fiber type compatibility (single-mode vs. multi-mode)
  • Match interface standards (LC/SC/ST/FC/MPO)
  • Evaluate optical performance requirements
  • Consider environmental conditions (temperature, humidity)
  • Assess density requirements for space-constrained applications
  • Verify compliance with industry standards (IEC 61754, TIA-942)

Case Study: A hyperscale data center upgraded to MPO-12 adapters to achieve 400Gbps transmission capacity, reducing cable management complexity by 60%.

  • Transition to multi-fiber solutions (MPO-24/32) for 800Gbps systems
  • Development of bend-insensitive fiber adapters
  • Integration of smart diagnostic features (built-in optical sensors)
  • Miniaturization for 5G small cell deployments
  • Adoption of polymer-based photonic integrated circuits

Market forecasts predict a CAGR of 12.3% through 2027, driven by cloud infrastructure expansion and IoT connectivity demands.

RFQ BOM Call Skype Email
Top