FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
F32R-1A7H1-11016 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1674
SFW6R-6STE9LF Storage & Server IO (Amphenol ICC)	CONN CIC TOP 6POS 1.00MM R/A	0
67516-216 Storage & Server IO (Amphenol ICC)	CONN FFC RCPT 16POS 2.54MM	0
SFW6R-2STZE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 6POS 1.00MM R/A	0
SFV32R-1STBE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 32POS 0.50MM R/A	0
F32R-1A7H1-11057 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1800
SLW30S-5C7LF Storage & Server IO (Amphenol ICC)	CONN CIC VERT 30POS 1.00MM PCB	0
SFV22R-2STBE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC TOP 22POS 0.50MM R/A	5963
SFW15R-6STE1LF Storage & Server IO (Amphenol ICC)	CONN CIC TOP 15POS 1.00MM R/A	0
66226-034LF Storage & Server IO (Amphenol ICC)	CONN FFC HEADER 2POS 2.54MM	0
SFW12R-5STE9LF Storage & Server IO (Amphenol ICC)	CONN CIC BOTTOM 12POS 1MM R/A	0
10064555-332210ELF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 33POS 0.30MM R/A	0
HFW21R-2STE1H1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 21POS 1MM R/A	0
SFW16R-1STAE1LF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 16POS 1.00MM R/A	0
HFW26R-1STE1H1LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 26POS 1.00MM R/A	0
SFW20R-2STGE1LF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 20POS 1MM R/A	0
F32R-1A7H1-11023 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1800
SFV31R-1STBE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 31POS 0.50MM R/A	0
F32R-1A7H1-11024 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1470
SFW6R-2STE1 Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 6POS 1.00MM R/A	0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities