ample-chip ample-chip
RFQ
BOM

FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
AYF531435A

AYF531435A

Panasonic

CONN FFC/FPC 14POS 0.5MM SMD R/A

584
AYF530265T

AYF530265T

Panasonic

CONN FPC 2POS 0.50MM R/A

2850
AYF531635

AYF531635

Panasonic

CONN FFC FPC 16POS 0.50MM R/A

0
AYF331135

AYF331135

Panasonic

CONN FPC 11POS 0.30MM R/A

0
AYF330935

AYF330935

Panasonic

CONN FPC 9POS 0.30MM R/A

1070
AYF330735A

AYF330735A

Panasonic

CONN FPC 7POS 0.30MM R/A

0
AYF533435A

AYF533435A

Panasonic

CONN FFC/FPC 34POS 0.5MM SMD R/A

462
AYF564035A

AYF564035A

Panasonic

CONN FFC FPC 40POS .5MM SMT

761
AYF331335A

AYF331335A

Panasonic

CONN FPC 13POS 0.30MM R/A

0
AYF352325A

AYF352325A

Panasonic

CONN FPC TOP 23POS 0.3MM SMD R/A

965
AYF333335A

AYF333335A

Panasonic

CONN FPC 33POS 0.30MM R/A

497
AYF532265TA

AYF532265TA

Panasonic

CONN FPC 22POS 0.50MM R/A

127
AYF333135

AYF333135

Panasonic

CONN FPC 31POS 0.30MM R/A

0
AYF533265TA

AYF533265TA

Panasonic

CONN FPC 32POS 0.5MM SMD R/A

401
AYF214135A

AYF214135A

Panasonic

CONN FPC 41POS 0.2MM SMD R/A

456
AYF530835A

AYF530835A

Panasonic

CONN FFC/FPC 8POS 0.5MM SMD R/A

181
AYF531065TA

AYF531065TA

Panasonic

CONN FPC 10POS 0.5MM SMD R/A

137
AYF424035A

AYF424035A

Panasonic

Y4BH FPC .4MM 40 PIN CONN 85/90

389
AYF333935

AYF333935

Panasonic

CONN FPC 39POS 0.30MM R/A

6693
AYF332565A

AYF332565A

Panasonic

CONN FPC 25POS 0.30MM R/A

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
RFQ BOM Call Skype Email
Top