FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
XF2M-2015-1A-R100 Omron Electronics Components	CONN FPC 20POS 0.50MM R/A	207
XF3M-2215-1B Omron Electronics Components	CONN FFC FPC 22POS 0.50MM R/A	1430
XF2M-3315-1A-R100 Omron Electronics Components	CONN FPC 33POS 0.50MM R/A	200
XF2U-1815-3A Omron Electronics Components	CONN FPC 18POS 0.50MM R/A	107
XF3M-1415-1B Omron Electronics Components	CONN FFC FPC 14POS 0.50MM R/A	0
XF2M-2215-1A Omron Electronics Components	CONN FPC 22POS 0.50MM R/A	582
XF2M-5515-1AH Omron Electronics Components	CONN FPC 55POS 0.50MM R/A	1310
XF3M(1)-1415-1B Omron Electronics Components	CONN FFC FPC 14POS 1.00MM R/A	0
XF3A-1255-41A Omron Electronics Components	CONN FPC TOP 12POS 0.30MM R/A	1390
XF3M-1015-1B Omron Electronics Components	CONN FFC FPC 10POS 0.50MM R/A	5965
XF3M(1)-2215-1B Omron Electronics Components	CONN FFC 22POS 1.00MM R/A	1433
XF3M(1)-2015-1B Omron Electronics Components	CONN FFC 20POS 1.00MM R/A	1396
XF2J-1624-11A Omron Electronics Components	CONN FPC VERT 16POS 0.50MM SMD	0
XF3M(1)-3015-1B Omron Electronics Components	CONN FFC FPC 30POS 1.00MM R/A	1315
XF3M(1)-0815-1B Omron Electronics Components	CONN FFC FPC 8POS 1.00MM R/A	1771
XF3M109151BR100 Omron Electronics Components	CONN FFC FPC 9POS 1.00MM R/A	0
XF3M115151BR100BYOMZ Omron Electronics Components	CONN FFC FPC 15POS 1.00MM R/A	200
XF2M-3615-1A-R100 Omron Electronics Components	CONN FPC 36POS 0.50MM R/A	0
XF3M120151BR100 Omron Electronics Components	CONN FFC FPC 20POS 1.00MM R/A	0
XF3M(1)-0415-1B Omron Electronics Components	CONN FFC FPC 4POS 1.00MM R/A	23

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities