FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
687126183722 Würth Elektronik Midcom	CONN FFC BTM 26POS 0.5MM SMD R/A	0
686116183522 Würth Elektronik Midcom	CONN FFC BTM 16POS 1MM SMD R/A	3858
687110183722 Würth Elektronik Midcom	CONN FFC BTM 10POS 0.5MM SMD R/A	153
686120188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2968
687144149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 44POS	1569
68711414522 Würth Elektronik Midcom	CONN FPC BOTTOM 14POS 0.50MM R/A	0
68711814522 Würth Elektronik Midcom	CONN FPC BOTTOM 18POS 0.50MM R/A	1975
687114183622 Würth Elektronik Midcom	CONN FFC TOP 14POS 0.5MM SMD R/A	523
686104183422 Würth Elektronik Midcom	CONN FFC TOP 4POS 1MM SMD R/A	1760
687106182122 Würth Elektronik Midcom	CONN FFC FPC 6POS 0.5MM R/A	1492
687110149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 10POS	625
68713014522 Würth Elektronik Midcom	CONN FPC BOTTOM 30POS 0.50MM R/A	738
686116183422 Würth Elektronik Midcom	CONN FFC TOP 16POS 1MM SMD R/A	844
687310124422 Würth Elektronik Midcom	CONN FPC VERT 10POS 0.50MM SMD	0
686106148922 Würth Elektronik Midcom	CONN 1MM HORZ BOTTOM SMD 6POS	1993
686130188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2986
686106188822 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT VERTICAL LIF	1371
686106183422 Würth Elektronik Midcom	CONN FFC TOP 6POS 1MM SMD R/A	0
686104188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2934
68610814122 Würth Elektronik Midcom	CONN FPC TOP 8POS 1.00MM R/A	1778

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities