FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
FF0829SA1-R200

FF0829SA1-R200

JAE Electronics

CONN FPC BOTTOM 29POS 0.20MM R/A

0

FF02S17SV1-R3000

FF02S17SV1-R3000

JAE Electronics

CONN FPC BOTTOM 17POS 0.30MM R/A

0

WD3M148UQ-8

WD3M148UQ-8

JAE Electronics

CONNECTOR FPC

0

FF0134SA1E

FF0134SA1E

JAE Electronics

CONN FPC BOTTOM 34POS 0.50MM R/A

0

FA5B030HP2R3000

FA5B030HP2R3000

JAE Electronics

CONNECTEOR

0

IL-FPR-16S-HF-N1

IL-FPR-16S-HF-N1

JAE Electronics

CONN FPC BOTTOM 16POS 0.50MM R/A

0

FG2S045JA1

FG2S045JA1

JAE Electronics

CONN FPC 45POS 0.2MM

0

FF0239SS1

FF0239SS1

JAE Electronics

CONN FPC BOTTOM 39POS 0.30MM R/A

0

IL-FPR-18S-HF-N1

IL-FPR-18S-HF-N1

JAE Electronics

CONN FPC BOTTOM 18POS 0.50MM R/A

0

FB10S041JA2

FB10S041JA2

JAE Electronics

CONNECTOR FPC

0

FB6S057JA1R3000

FB6S057JA1R3000

JAE Electronics

CONN FPC BOTTOM 57POS 0.30MM R/A

0

FB8S039JA1R2000

FB8S039JA1R2000

JAE Electronics

CONN FPC TOP 39POS 0.30MM R/A

0

IL-FPR-U26S-HF-N1

IL-FPR-U26S-HF-N1

JAE Electronics

CONN FPC TOP 26POS 0.50MM R/A

0

IL-FPR-U31S-HF-N1

IL-FPR-U31S-HF-N1

JAE Electronics

CONN FPC TOP 31POS 0.50MM R/A

0

FA5B036HP1

FA5B036HP1

JAE Electronics

CONN FPC BOTTOM 36POS 0.50MM SMD

0

WD3F148UQ-4

WD3F148UQ-4

JAE Electronics

CONNECTOR FPC

0

FA5B006HP2R3000

FA5B006HP2R3000

JAE Electronics

CONNECTEOR

0

FB3S017C11R3000

FB3S017C11R3000

JAE Electronics

CONN FPC BOTTOM 17POS 0.30MM R/A

0

FA5B020HP2R3000

FA5B020HP2R3000

JAE Electronics

CONNECTEOR

0

FB3S051C12R3000

FB3S051C12R3000

JAE Electronics

CONN FPC BOTTOM 51POS 0.30MM R/A

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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