FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
FH52E-30S-0.5SH(99) Hirose	CONN FFC 30POS 0.5MM SMD	1016
046809606110846+ KYOCERA Corporation	0.5MM PITCH - 6 POS - RT ANGLE -	9263
SLW5S-5C7LF Storage & Server IO (Amphenol ICC)	CONN CIC VERT 5POS 1.00MM PCB	1916
FH12-26S-1SH(55) Hirose	CONN FFC BOTTOM 26POS 1.00MM R/A	1054
0512811894 Woodhead - Molex	CONN FFC FPC 18POS 0.50MM R/A	8986
FH39J-25S-0.3SHW(99) Hirose	CONN FPC 25POS 0.30MM R/A	0
687117149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 17POS	0
5034801400 Woodhead - Molex	CONN FFC FPC 14POS 0.50MM R/A	841136000
0522710469 Woodhead - Molex	CONN FPC BOTTOM 4POS 1.00MM R/A	784
FH28D-20S-0.5SH(05) Hirose	CONN FFC BOTTOM 20POS 0.50MM R/A	20
0527931070 Woodhead - Molex	CONN FPC TOP 10POS 1.00MM R/A	4923
FFC3B11-12-T Global Connector Technology, Limited (GCT)	12W, 1.0MM FFC CONN, R/A,TOP CON	2617
046232106015800 KYOCERA Corporation	CONN FFC FPC VERT 6POS 1MM SMD	0
5035663700 Woodhead - Molex	CONN FPC BOTTOM 37POS 0.30MM R/A	1097
006208516210000 KYOCERA Corporation	CONN FFC FPC VERT 16POS 1MM SMD	0
HF513-40-01-VE Yamaichi Electronics	AUTOMOTIVE PRESS-RELEASE FFC/FPC	50
0522071560 Woodhead - Molex	CONN FFC FPC TOP 15POS 1MM R/A	7553
0526101233 Woodhead - Molex	CONN FPC VERT 12POS 1.00MM SMD	5807
FH33J-16S-0.5SH(99) Hirose	CONN FFC BOTTOM 16POS 0.50MM R/A	0
TF13BA-10S-0.4SH(800) Hirose	CONN FFC 10POS 0.40MM SMD	24983

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities